Shenzhen Xpectvision Technology Co., Ltd.

Chongshen Song

Peiyan Cao

Yurun Liu

Disclosed herein is an image sensor and a method of making the image sensor. The image sensor may comprise one or more packages of semiconductor radiation detectors. Each of the one or more packages may comprise a radiation detector that comprises a radiation absorption layer on a first strip of semiconductor wafer and an electronics layer on a second strip of semiconductor wafer. The radiation absorption layer may be continuous along the first strip of semiconductor wafer with no coverage gap. The first strip and the second strip may be longitudinally aligned and bonded together. The radiation detector may be mounted on a printed circuit board (PCB) and electrically connected to the PCB close to an edge of the radiation detector.

Methods of making semiconductor X-ray detector

Disclosed herein is radiation detector comprising: a radiation absorption layer configured to generate electric signals by absorbing radiation particles; an electronics layer comprising an electronic system configured to process or interpret the signals; a flexible PCB configured to receive output from the electronic system; wherein the radiation absorption layer and the flexible PCB are mounted on a same side of the electronics layer.

Packaging of radiation detectors

Disclosed herein is an image sensor comprising: a first package comprising a plurality of radiation detectors mounted on a printed circuit board (PCB); wherein a dead zone of the first package does not extend between neighboring radiation detectors among the plurality of radiation detectors; wherein the radiation detectors have no guard rings or sidewall doping.

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Shenzhen, China

Chongshen Song