Hon Hai Precision Industry Co., Ltd.

Chong Shin Mou

Nan-Tsung Huang

An optoelectronic package () includes a base substrate (), a plurality of solder pads () and a can (). The base substrate includes a mounting seat () laminated first and second layer (). The solder pads () respectively attach to a top surface () and a bottom surface () of the base substrate and are electrically interconnected with each other via conductive material filled the through-holes () and conductor trace (). Optoelectronic components (not shown) are attached to the top surface of the base substrate and make electrical connection with the solder pads. The can includes a transparent device (), an metal enclosure () and a housing (), which hermetically seals to the base substrate protecting the optoelectronic components.

Growing community of inventors

Tu-Chen, Taiwan

Chong Shin Mou