Macronix International Co., Ltd.

Ememory Technology Inc.

Powerchip Semiconductor Manufacturing Corporation

Beautimode Corporation

Macronix International, Col, Ltd.

Chong-Jen Huang

Kuang-Wen Liu

Hsin-Huei Chen

Chih-Hao Wang

Jia-Rong Chiou

Jui-Lin Lu

Chong-Mu Chen

Ming-Hung Chou

Shyi-Shuh Pan

Chun-Cheng Chen

Shou-Wei Hwang

Jie-Hau Huang

Yu-Ming Hsu

Lenvis Liu

Chun-Chin Huang

Wan-Ling Huang

Jo-Han Tsai

Jhih-Fang Fong

Wei-Wei Yeh

Ye-Sing Lu

Frank Chiou

Tony Wang

A memory device is provided. The memory device includes at least one memory chip and a logic chip. Each of the at least one memory chip includes a memory array, a plurality of bit lines, and a plurality of data paths. The data paths respectively correspond to the bit lines. The number of the data paths is equal to or less than the number of the bit lines. A plurality of data transmission ports of the logic chip are electrically connected to the data paths of the at least one memory chip in a one-to-one manner. The number of the data transmission ports is equal to a sum of the data paths of the at least one memory chip.

Memory device with high data bandwidth

Ticket dispenser

A semiconductor device having a silicon oxide/silicon nitride/silicon oxide ('ONO') structure is formed by providing a first silicon oxide layer and a silicon nitride layer over a substrate having a memory region and a logic device region; patterning the first silicon oxide layer and the silicon nitride layer to define bottom oxide and silicon nitride portions of partially completed ONO stacks and to expose the substrate in the logic device regions; performing a rapid thermal annealing process in the presence of a radical oxidizing agent to form concurrently a second silicon oxide layer on the exposed surface of the silicon nitride layer and a gate oxide layer over the substrate; and depositing a conductive layer over the completed ONO stacks and the gate oxide. The invention is employed in manufacture of, for example, memory devices having and peripheral logic devices and memory cells including ONO structures. Exposing the patterned silicon nitride to the oxygen radical during the RTO according to the invention significantly reduces the processing time, and reduces the thermal budget. Moreover, because according to the invention the upper surface and the sidewalls of the silicon nitride layer are covered by the top oxide layer, the silicon nitride is not exposed during a subsequent cleaning process. As a result of increased contact area between the polysilicon gate and the top oxide layer, the coupling ratio of the gate is increased.

Method for forming oxide on ONO structure

Stabilization of photolithography process parameters, the photomask being used, and the manufacturing method thereof is provided where a formal pattern layout is combined with a dummy pattern. A photomask is manufactured by utilizing the combined pattern layout so that density changes between the pattern structure layers of the multi-layer semiconductor integrated circuits are minimized.

Multi-layer semiconductor integrated circuits enabling stabilizing photolithography process parameters, the photomask being used, and the manufacturing method thereof

A method of fabricating a read only memory cell array is described. A patterned film is formed over the substrate to define the predetermined positions of bit lines on the substrate and exposing a plurality of predetermined portions of the substrate. A plurality of field oxide layers is formed on the exposed portions of the substrate to define the positions of channels. After removing the patterned film, ions are implanted into the substrate to form the bit lines by using the field oxide layer as implanting mask. The field oxide layer is removed to form several recesses on the substrate. Thereafter, a gate insulating layer and word lines are formed over the substrate, and the recess channels are formed underneath the gate-insulating layer. The length of the recess channel is large enough to reduce the short channel effect.

Method of fabricating read only memory and memory cell array

Roughly described, a device having twin bit floating gate memory cells is fabricated by first providing a substrate having formed thereon, within a memory area, a composite charge storage film and a protective liner layer over the composite film. The memory area further includes oxide features over buried diffusion regions in the substrate, and polysilicon spacers over the composite film against the sidewalls of the oxide features. The method further involves etching an isolation trench through the composite film laterally between two of the oxide features, using the polysilicon spacers as a mask, and forming an insulator in the trench. A gate conductor is then formed overlying both the composite film and the filled isolation trench between the two oxide features.

Method for fabricating a floating gate memory device

An option fuse circuit, which can be viewed as a latch-type option fuse circuit, is manufactured with a standard single-poly CMOS manufacturing process. The option fuse circuit includes a non-volatile memory module for storing a logic bit in a data program status, a data control circuit electrically connected to the non-volatile memory module for controlling operations of the option fuse circuit, and an output circuit electrically connected to the data control circuit for outputting the logic data bit in a data read status.

Pure CMOS latch-type fuse circuit

The invention provides a memory device including a memory substrate, an insulating layer, a shielding metal layer, a second dielectric layer and a second metal layer. The memory substrate includes a substrate, a memory cell area, a peripheral circuit area, a first dielectric layer and a first metal layer. The first dielectric layer is formed on the memory area and the peripheral circuit area, which are formed on the substrate. The first metal layer is formed on the first dielectric layer while the insulating layer is formed on the first dielectric layer not covered with the first metal layer. The shielding metal layer is formed on the insulating layer over the memory cell area. The second dielectric layer is formed on the shielding metal layer, the insulating layer not covered with the shielding metal layer and the first metal layer not covered with both the shielding layer and the insulating layer. The second metal layer is formed on the second dielectric layer.

Method for manufacturing a memory device

Memory device and manufacturing method thereof

The present invention provides a memory array fabricated by complementary metal-oxide-semiconductor salicide process. The memory array comprises a semiconductor substrate. Multitudes of first isolation devices are aligned in the semiconductor substrate and second isolation devices aligned on the semiconductor substrate. The alignment of the second isolation devices is parallel to one of the first isolation devices. Some polysilicon lines are on the second isolation devices therefor have null memory function. A conductive structure is below a surface of the semiconductor substrate. The conductive structure is located between the first isolation devices. A conductive contact is on the conductive structure. The correspondence of the first isolation devices and the polysilicon lines can prevent the conductive structures from short effect.

Memory array with salicide isolation

A salicide integrate solution for embedded virtual-ground memory of the present invention provides a controlled distance between poly gates. In this way, the spacers formed on the sidewalls of the poly gates become self fill-upon spacers, and the surface of the substrate is not exposed. Thus, the salicides will not be formed on the surface of the substrate causing the connection of the buried diffusion regions. Moreover, the present invention provides two dummy poly gates located on the outside of the poly gates, so that the buried diffusion regions on the surface of the embedded virtual-ground memory are covered by the poly gates and self fill-up spacer. Utilizing the present invention, the process of forming salicides on the memory cell region and the peripheral logic region can be integrated together.

Salicide integrated solution for embedded virtual-ground memory

A memory array region and a periphery circuit region are defined on a silicon substrate of a semiconductor wafer. A plurality of gates is formed on the silicon substrate in both the memory array region and the periphery circuit region. A barrier layer and a dielectric layer are formed, respectively, on the semiconductor wafer. Therein, the barrier layer covers the gates and the barrier layer fills a space between two gates. Following that, the dielectric layer atop each gate is removed and the dielectric layer remaining in the space between two gates is aligned to the surface of the gates. A photoresist layer is formed to cover the memory array region followed by an etching process to remove the dielectric layer and the barrier layer down to the surface of the silicon substrate. The photoresist layer and the barrier layer atop the gate in the memory array region are removed. Finally, a salicide process is performed.

Method of fabricating a salicide of an embedded memory

A method for manufacturing a flash memory device with dual floating gates is disclosed. The method use a self-align etching technique to form dual floating gates by using dual spacers as masks. First of all, a semiconductor substrate having a first insulating layer thereon and a first conductive layer formed over the first insulating layer is provided. Then a second insulating layer is formed and patterned to etch to form a trench therein. Next a dielectric layer is deposited and anisotropically etched to form dual spacers in the trench. After removing the second insulating layer, etching the first conductive layer to expose the first insulating layer, and removing the spacers sequentially, dual floating gates are formed. Two doped regions separately located on two sides of said dual floating gates are then formed by using a photolithography and an ion implantation processes After thickening the first insulating layer, a composite layer, a second conductive layer and a third insulating layer is formed over the semiconductor substrate sequentially.

Growing community of inventors

Taipei, Taiwan

Chong-Jen Huang