Asm Technology Singapore Pte Ltd

Chong Hao Chen

Ka Shing Kenny Kwan

Wei Liu

Yam Mo Wong

Yue Zhang

Gang Ou

Zheng Yu Lin

A wire clamp includes a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end. The second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface.

Wire clamp with piezoelectric actuator and method and apparatus for applying a preload force to the piezoelectric actuator

An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

Wire clamp gap control mechanism and method

A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.

Bondhead for wire bonding apparatus

The invention provides an apparatus and method to calibrate a clamp, such as a wire clamp, which is suitable for use with a wire-bonding machine for semiconductor devices. A contact means is arranged to be contacted by an arm of the clamping device and a sensing mechanism is positioned in operational relationship with the arm. An indexing means is adapted to change positions of the clamping device relative to the contact means incrementally as said arm maintains contact with the contact means. The sensing mechanism is capable of sensing feedback from said arm at various positions of the clamping device relative to the contact means. The apparatus is particularly suitable for measuring a clamping force and/or a clamping gap between clamping arms of the clamping device.

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Singapore, Singapore

Chong Hao Chen