Samsung Electro-mechanics Co., Ltd.

Chon Su Kyong

Ho Seop Jeong

Sang Hyuck Lee

Hun Joo Hahm

Jin Ha Kim

Hyung Suk Kim

Jin Jong Kim

Joo Hee Jun

Yun Seok Choi

Sung Hwa Kim

Provided are wafer scale lenses having a diffraction surface as well as a refractive surface, and an optical system having the same. The wafer scale lens includes a lens substrate, a first lens element formed on the object side of the lens substrate, having a positive refractive power, a second lens element formed on the image side of the lens substrate, having a diffraction surface, and a third lens element deposited on the diffraction surface of the second lens element, having a negative refractive power. The invention allows miniaturized optical system and efficient calibration of angle of view, reducing the angle of light incident onto the diffractive surface, thereby increasing diffraction efficiency and eliminating high order diffraction light to improve picture quality.

Wafer scale lens and optical system having the same

An inner zoom lens system for use in a camera module having an image sensor and appropriate for an inner-focus type is provided. The inner zoom lens system includes, sequentially from an object side, a first lens group, a second lens group, a third lens group, and a fourth lens group. The first lens group is fixed and has minus refractive power. The second lens group has plus refractive power and performs a zooming operation by moving such that an interval between the first and the second lens groups is reduced when zooming from a wide angle end to a telephoto end. The third lens group has minus refractive power and moves such that a position of an image plane is corrected depending the zooming due to the movement of the second lens group. The fourth lens group has plus refractive power.

Inner zoom lens system

An inner-focus type zoom lens system used for a camera module having an image sensor and using an LC lens is provided. The inner-focus type zoom lens system includes an objective lens group, a condensing lens group, at least one moving lens group, and an LC lens. The objective lens group is located most closely to an object side and fixed, and the condensing lens group is located most closely to an image side and fixed. The moving lens group is located between the objective lens group and the condensing lens group and moved for zooming. The LC lens includes an inner space filled with an LC material whose refractive index and abbe number change according to an applied voltage. The LC lens compensates for an image plane using the changes of the refractive index and the abbe number of the LC material when the zooming is performed by the moving of the moving lens.

Inner focus type zoom lens system

A subminiature optical system used in a subminiature image sensor module is provided. The subminiature optical system has a first lens group, a second lens group and a third lens group sequentially arranged from the object side. The first lens group has a first lens of plus refractive power and a second lens of minus refractive power, the second lens being cemented to the first lens. The second lens group has a third lens where at least one refraction surface is aspherical and has minus refractive power. The third lens group has a fourth lens where at least one refraction surface is aspherical and has minus refractive power. The subminiature optical system can have a high resolution and a compact-sized lens construction with a small number of lens combinations. Also, the subminiature optical system can have a small dimension of an axial direction in a whole construction.

Subminiature optical system

The present invention relates to a dipolar LED and a dipolar LED module incorporating the same, in which an upper hemisphere-shaped base houses an LED chip therein and adapted to radiate light from the LED chip to the outside, and a pair of reflecting surfaces placed at opposed top portions of the base in a configuration symmetric about an imaginary vertical plane. The vertical plane passes through the center of the LED chip perpendicularly to a light-emitting surface of the LED chip. The reflecting surfaces are extended upward away from the top portions of the base to reflect light from the LED chip away from the imaginary vertical plane. A pair of radiating surfaces are placed outside the reflecting surfaces, respectively, to radiate light from the reflecting surfaces to the outside. In this way, light emission from the LED chip can be concentrated in both lateral directions.

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Seoul, South Korea

Chon Su Kyong