Samsung Display Co., Ltd.

Sungkyunkwan University

Choelmin Jang

Myungsoo Huh

Cheollae Roh

Dongkyun Ko

Inkyo Kim

Sungchul Kim

Sunghun Key

Junggon Kim

Sungmin Cho

Taehoon Yang

Sunho Kim

Donghwan Shim

Sunhee Lee

Jaehoon Kim

Changhee Lee

Gunhee Kim

Sukwon Jung

Seungwoo Seo

Jeong Hye Choi

Nam Ha

Byunghyuk Kwon

Sangjoon Seo

Eun Ae Jung

Jaihyuk Choi

Heeyeop Chae

Ho Kyoon Chung

Seung Woo Seo

Sang Joon Seo

An apparatus and method for manufacturing a display apparatus includes: a chamber; a first nozzle unit at the chamber, the first nozzle unit configured to deposit an organic layer or an inorganic layer on a substrate; a second nozzle unit at the chamber, the second nozzle unit configured to deposit the organic layer or the inorganic layer on a substrate and the second nozzle unit being linearly aligned with the first nozzle unit in a first direction; and an injection nozzle unit between the first nozzle unit and the second nozzle unit, the injection nozzle unit configured to inject a first gas in the chamber toward the substrate.

Apparatus for manufacturing display apparatus and method of manufacturing display apparatus

A display device includes a display area and a peripheral area. A display layer includes a plurality of display elements arranged thereon. A thin-film encapsulation layer is arranged on the display layer and includes first, second, and third encapsulation layers. The second encapsulation layer is on the first encapsulation layer. The third encapsulation layer is on the second encapsulation layer. A touch sensing layer is arranged on the thin-film encapsulation layer and includes touch electrodes and trace lines. The display area is partially bent about an axis, and the third encapsulation layer is bent along the axis and has a structure in which a first layer and a second layer are alternately stacked. The first layer includes an inorganic insulating material, and the second layer includes a silicon carbon compound material.

Display device having a bent portion

A multilayer encapsulation thin-film and a method and apparatus for preparing a multilayer encapsulation thin-film are provided. The multilayer encapsulation thin-film includes an inorganic thin film that includes a metal oxide, and an organic thin film that includes a polymer and is formed on the inorganic thin film, where the inorganic thin film and the organic thin film are alternately stacked in multiple layers.

Multilayer encapsulation thin-film

A display apparatus includes a substrate, a display portion that includes a plurality of pixels disposed on the substrate, and an encapsulation portion that covers the display portion and includes a hybrid encapsulation layer that includes a plurality of inorganic layers and at least one organic layer that includes a plasma polymer. An end of the hybrid encapsulation layer includes a tip portion that includes an inorganic material and a multi-layered portion which extends from the tip portion toward a central portion of the substrate and in which the plurality of inorganic layers and the at least one organic layer are sequentially and alternately stacked, and a thickness of each of the inorganic layers and the organic layer decreases toward the tip portion.

Display apparatus and method of manufacturing the same

A light emitting diode according to embodiments of the present disclosure includes a first electrode, a second electrode opposite the first electrode, an emission layer between the first electrode and the second electrode, the emission layer including a quantum dot, a first charge transfer layer between the first electrode and the emission layer, a second charge transfer layer between the second electrode and the emission layer, and an insulating layer in at least one position between the first charge transfer layer and the emission layer, and/or between the second charge transfer layer and the emission layer, wherein the insulating layer includes an inorganic material. The light emitting diode and a display device including the same show improved life characteristics and emission efficiency properties.

Light emitting diode, manufacturing method thereof and display device including the same

A deposition apparatus and method of deposition are provided. The deposition apparatus includes a gas supply unit, including: a first process gas supply unit blowing a first process gas onto a deposition-target surface; a second process gas supply unit blowing a second process gas different from the first process gas onto the deposition-target surface of the substrate; and air curtain units blocking an area between an area where the process gas is blown and an area where the second process gas is blown, by blowing an inert gas.

Deposition apparatus and deposition method using the same

A deposition apparatus includes a deposition gas supply unit including an opening and closing valve. The deposition gas supply unit is configured to selectively supply a source gas or a mixture gas into a chamber. A cleaning gas supply unit is configured to supply a cleaning gas into the chamber. A deposition head includes a first deposition head including a first nozzle configured to supply the source gas and the cleaning gas and a second deposition head including a second nozzle configured to supply the source gas, the mixture gas, and the cleaning gas. An exhaust unit is configured to discharge the cleaning gas and remaining source and mixture gases from the chamber. A cleaning gas valve unit is configured to be selectively opened and closed to supply the cleaning gas to at least any one of the first deposition head and the second deposition head.

Deposition apparatus including cleaning gas valve unit and deposition method including the same

Provided are an encapsulating structure, an organic light-emitting display device including the encapsulating structure, and a method of manufacturing the same. The encapsulating structure includes a first barrier layer including a first inorganic layer having a first thickness; a plasma polymer layer on the first inorganic layer, the plasma polymer layer having a second thickness smaller than or equal to the first thickness; and a second barrier layer including at least one second inorganic layer on the plasma polymer layer. The at least one second inorganic layer has a third thickness, and the third thickness is smaller than or equal to the second thickness.

Encapsulating structure capable of securing barrier characteristics with reduced thickness, display device having encapsulating structure and method of manufacturing the same

An apparatus and a method of manufacturing a display apparatus are disclosed. In one aspect, the apparatus includes a chamber and an inorganic layer forming nozzle unit formed in the chamber and configured to form at least one inorganic layer. The apparatus also includes an organic layer forming nozzle unit formed in the chamber and configured to form at least one organic layer, wherein the organic layer forming nozzle unit is arranged substantially in line with the inorganic layer forming nozzle unit. The apparatus further includes a separating nozzle unit formed between the inorganic layer forming nozzle unit and the organic layer forming nozzle unit and configured to spray an inert gas.

Apparatus and method of manufacturing display apparatus

A display apparatus and an apparatus for and method of manufacturing the display apparatus. The display apparatus includes: a substrate; a display unit formed on the substrate; and a thin film encapsulation layer formed on the display unit. The thin film encapsulation layer includes an inorganic layer, and the inorganic layer includes a first sub-inorganic layer including a compound oxide including at least two of aluminum (Al), zinc (Zn), zirconium (Zn), and hafnium (Hf).

Method of manufacturing the display apparatus including first inorganic layer and second inorganic layer

Provided is a cover window includes a first layer including a polymer material, a second layer above a first surface of the first layer and including an oxide of a first metal, and an intermediate region between the first layer and the second layer, wherein the intermediate region includes the oxide of the first metal where the first metal binds to a dangling bond of oxygen of the polymer material, and the oxide of the first metal included in the second layer has a different composition ratio than the oxide of the first metal included in the intermediate region.

Growing community of inventors

Yongin-si, South Korea

Choelmin Jang