Samsung Electronics Co., Ltd.

Choel-Hwyi Bae

Ju-Youn Kim

You-Seung Jin

Chang-Min Hong

Sang-deok Kwon

Cheong-Sik Yu

Gwang-Hyeon Baek

Min-Geon Cho

Mi-Joung Lee

Jin-Hee Kim

Dong-hun Lee

Yeong-Lyeol Park

Nam-Young Lee

Yong-woon Han

Hyock-Jun Lee

A semiconductor device includes a semiconductor substrate including a first region and a second region, a first high-k dielectric film pattern on the first region, a second high-k dielectric film pattern on the second region and having the same thickness as the first high-k dielectric film pattern. First and second work function control film patterns are positioned on the high-k dielectric film patterns of the first region. Third and fourth work function control patterns are positioned on the high-k dielectric film pattern of the second region, the first work function control pattern being thicker than the third work function control pattern and the fourth work function control pattern being thicker than the second.

Semiconductor device including work function control film patterns and method for fabricating the same

There is provided a semiconductor device comprising, at least one SRAM cell, wherein the SRAM cell includes a pull-up transistor, a pull-down transistor, and a pass-gate transistor, and an inversion-layer thickness (Tinv) of a gate stack of the pass-gate transistor is different from Tinv of a gate stack of the pull-up transistor and Tinv of a gate stack of the pull-down transistor.

Semiconductor device

In an apparatus and method for automatically correcting a design pattern in view of different process defects, defect characteristic functions that indicate frequencies of each process defect independent from one another are generated, and a normalization factor that indicates relationships between the defect characteristic functions is determined. A general defect characteristic function indicating a frequency of general defects is generated using the defect characteristic functions and the normalization factor. The general defect causes the same process failure as caused by each of the process defects. The design pattern is modified using the general defect characteristic function in such a manner that the frequency of the general defects is minimized when at least one portion of the design pattern corresponding to the model pattern is transcribed on the substrate. Accordingly, the whole design pattern may be automatically corrected based on the general defect characteristic function.

Method of correcting a design pattern for an integrated circuit and an apparatus for performing the same

Disclosed is a method of analyzing layouts of semiconductor integrated circuit devices. The method includes calculating random fault rates, systematic fault rates, parametric fault rates, and areas of a plurality of layouts of interest; calculating area-based fault rates of the plurality of layouts of interest using the random fault rate, systematic fault rate, parametric fault rate, and area; and selecting layouts of interest to be corrected from among the plurality of layouts of interest using the area-based fault rates of the plurality of layouts of interest.

Methods and systems for analyzing layouts of semiconductor integrated circuit devices

A monitoring pattern for detecting a defect in a semiconductor device allows a voltage contrast inspection which may be verified by an electrical test where no special test pattern is required for the electrical test. The monitoring pattern includes a test pattern with line shapes arranged in parallel and spaced apart at predetermined linewidths and intervals, and an interconnection layer connected to the test pattern, where the test pattern is adapted to be charged with a specific potential to be displayed as a voltage contrast image when scanned with an electron beam.

Monitoring pattern for detecting a defect in a semiconductor device and method for detecting a defect

A test pattern includes a normal pattern, an abnormal pattern having predetermined defects, and a conductive line electrically connected to the normal pattern and electrically isolated from the abnormal pattern. Thus, a non-contact test process and a contact test process may be compatible with the single test pattern.

Test pattern and method of monitoring defects using the same

A method of enhancing yield of semiconductor integrated circuit includes determining multiple experimental values, each experimental value corresponding to a distance from a side of a hole to an opposing side of a shape surrounding the hole, forming test patterns representing each of the experimental values on a wafer and calculating experimental value-based systematic fault rates from the test patterns; converting the experimental value-based systematic fault rates of the hole into the experimental value-based systematic fault rates, calculating a length of a side of the hole for which a distance between the side of the hole and the opposing side of the shape corresponds to each of experimental values, and calculating a systematic fault rate of the hole using the experimental value-based systematic fault rates per unit hole length and the length of the sides of the hole calculated for the respective experimental values in the desired layout.

Method and system for enhancing yield of semiconductor integrated circuit devices using systematic fault rate of hole

A test structure for inspecting an allowable process margin in a manufacturing process for a semiconductor device is provided. The test structure includes a plurality of grounded conductive lines on a substrate and electrically grounded to the substrate. A plurality of floating conductive lines are provided, each of the plurality of conductive lines being spaced apart from the grounded conductive lines and electrically separated from the grounded conductive lines on the substrate. A plurality of supplementary patterns are provided for measuring the allowable process margin by a voltage contrast between the grounded conductive lines and the floating conductive lines. Related methods of testing are also provided.

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Suwon-si, South Korea

Choel-Hwyi Bae