Asm Technology Singapore Pte Ltd

Cho Hin Cheuk

Pei Wei Tsai

Chak Tong Sze

Wing Sze Chan

Kam Sing Lee

Yui Kin Tang

Kut Lam

Si Ming Chan

Tsz Chun Chow

A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.

Semiconductor package testing apparatus

An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.

Apparatus for conducting automated maintenance of a test contactor module

A transfer apparatus has a conveying track for electronic devices in a row, two vacuum passages to create vacuum forces to hold electronic devices against the conveying track at first and second positions respectively preventing overlapping of electronic devices; and sensors arranged with respect to the conveying track, the first sensor detects presence or absence of the leading electronic device at the first position for removal of the leading electronic device from the conveying track, and the second sensor detects presence or absence of the leading electronic device at a sensor position between the first and second positions as the leading electronic device is conveyed along the conveying track from the second to the first vacuum passage.

Transfer apparatus for transferring electronic devices

Growing community of inventors

Hong Kong, China

Cho Hin Cheuk