The Furukawa Electric Co., Ltd.

Other

Sony Computer Entertainment Inc.

Chiyoshi Sasaki

Masami Ikeda

Junji Sotani

Yasuhiro Ootori

Masaru Ohmi

Hiroaki Maekawa

Toshikatsu Hama

Koichi Inoue

Takeshi Hirasawa

Masakazu Isemura

Toru Arimoto

Isao Tsukada

Takahiro Katayama

Ryouichi Kubota

Katsushi Itoh

Kouji Hirata

Nobuyuki Hashimoto

Yasuhiro Uchimura

A base block has a longitudinal direction and a width direction and includes a recessed part in which a heat receiving tubular portion is accommodated, and a container part of a heat pipe is caulked and fixed in a recessed part and a first metal part containing first metal having a melting point equal to or higher than 130° C. and equal to or lower than 400° C. and/or a first metal alloy having a melting point equal to or higher than 130° C. and equal to or lower than 400° C. is formed between the recessed part and an outer surface of the container part.

Heat pipe structure, heat sink, manufacturing method for heat pipe structure, and manufacturing method for heat sink

A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.

Heat pipe structure and caulking jig for heat pipe structure

A heat sink with a centrifugal fan comprising: a cover of a prescribed shape including an air intake port and an air discharge port; a heat receiving block thermally connected to a heat generating part to be cooled; a bottom portion which is excellent in heat transferability, thermally connected to one face of said heat receiving block, and engaged to said cover to form a space portion; a heat dissipating fin portion comprising a plurality of fins, received within the space portion, thermally connected to said bottom portion, and having a prescribed shape including at least an air inflow portion; and a centrifugal fan, a rotating shaft of which is arranged in a vicinity of the air inflow portion of said heat dissipating fin portion, which intakes air from the air intake port, generates an air flow through spaces formed between adjacent fins of said heat dissipating fin portion, and generates another air flow along an inner wall of said cover toward said air discharge port.

Heat sink with a centrifugal fan having vertically layered fins

A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to transfix said plurality of metal fins; a metal plate having a plurality of slits into which said respective heat dissipating portions are inserted and press-connected thereto with use of said elasticity; and a joining portion to join said metal plate and said heat dissipating portions which are inserted into said respective slits and fixed thereto.

Heat sink with heat dissipating fins and method of manufacturing heat sink

Provided is a structure in which a shieldand a heat sinkintegrated with a radiation finare sandwiched by a main substrateand a power source substrate. A hoodcovers the radiation finso as to collect air for cooling. Major parts of the main substrateare in contact with the heat sinkvia heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.

Circuit substrate unit and electronic equipment

A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin

A method for cooling a box with heat generating element received therein, comprising the steps of: (1) arranging in the box an air intake port for taking in air from outside and a discharge port for discharging air from the box to the outside, and installing a heat dissipating fin in the box, (2) disposing a part or a whole of the heat dissipating fin close to the air intake port within the box, and (3) causing the air taken in from the air intake port to pass through the heat dissipating fin to dissipate heat generated by the heat generating element, and then discharging air with a temperature raised by passing through the heat dissipating fin from the discharge port to outside of the box, thus cooling the box.

Apparatus for cooling a box with heat generating elements received therein and a method for cooling same

A device and method for manufacturing a heat sink that has a base and heat radiating fins of various shapes and has a prescribed strength, high heat-radiating efficiency, and whose base and heat-radiating fins are formed integrally. The heat sink manufacturing device includes a die casting machine which has the cavity for a base and heat-radiating fins, and which includes a fixed mold, a movable mold that can move in the vertical or up-down direction, and a slide mold that can move in the horizontal direction.

Heat sink manufacturing device and manufacturing method

A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.

Heat pipe hinge structure for electronic device

A heat conducting apparatus includes a heat pipe and a heat pipe supporting mechanism. The heat pipe conducts heat between a first member and a second member connected by hinge sections. The heat pipe has a first end portion attached to one of the first and second members and a second end portion extending substantially along a center line of the hinge sections. A heat pipe supporting mechanism is disposed on a member different from the one of the first and the second members of the heat pipe. The heat pipe supporting mechanism supports the second end portion so that the second end portion can freely move within a given range. The heat pipe supporting mechanism forms a thermal path between the first and second members together with the heat pipe.

Heat conducting apparatus and electronic apparatus having the same

A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.

A hot plate comprises a rectangular lower section having a heating chamber formed therein, and an upper section erected upward at the back end of the lower section and having a gas chamber formed therein. The gas chamber has a gas staying or receiving space located above the heating chamber. A liquid contained in the heating chamber is heated by a gas burner so that it is gasified into heated gas to heat a heating surface of the lower section. of the hot plate. Non-condensed gas created from the heated liquid is gathered in the gas staying or receiving space.

Hot plate

A heat pipe type heat-exchanger for ventilation is disclosed, having a plurality of heat pipes affixed with widely spaced fins provided internally in a box like case and arranged horizontally relative to the case, a partition plate dividing the inside of the case into two chambers on the right and left is provided crossing the heat pipes, an inlet and an outlet are formed for the respective chambers of the case, and fans for circulating the air to the respective chambers in opposite directions through the inlets and outlets are provided to make one chamber always an air-supplying chamber and other chamber always an air-discharging chamber. The connection point of power source wires of the fan motors is placed in the air-supplying chamber.

Growing community of inventors

Tokyo, Japan

Chiyoshi Sasaki