Righ, Inc.

Chiuwen Chen

Ming-Tsung Su

Chun-Wen Wang

Yuhan Liu

Haohsiu Huang

Huang Yu Ting

The present disclosure relates to a signal hub incorporating a cooling system for managing heat dissipation in compact electronic devices. The cooling system addresses airflow impedance challenges as the hub's volume decreases, which can inhibit heat transfer and create hotspots. Impedance-reducing elements, such as a rounded top shell profile and flow depression, direct airflow efficiently across a top cooling plate. The antenna carrier contours to the top shell, supporting antennas electrically coupled to the top cooling plate for RF shielding and heat dissipation. A fan in the middle cooling plate creates a vacuum force, drawing air through an ambient air gap, while an exhaust fin directs airflow away from the bottom shell, preventing particle buildup. A BTB shield provides EMI protection and thermal management, and the bottom cooling plate enhances cooling efficiency, ensuring optimal performance and reliability in reduced volume settings.

Growing community of inventors

Taipei, Taiwan

Chiuwen Chen