Richtek Technology Corporation

Richtek Technology Corporation, R.o.c

Chiung-Cheng Lo

Yu-Fu Kang

Chiung-Wen Lin

Shih-Chieh Lin

Chia-Yu Wu

Kuan-Lin Chen

Ning-Yuan Wang

The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

Micro-electro-mechanical system (MEMS) device

The invention provides a micro-electro-mechanical system device including: a substrate; a proof mass, including an outer frame which inwardly defines an internal space, and at least one inner extension portion which is directly connected to the outer frame and inwardly extends from the outer frame; at least one compliant structure, located in the internal space, and directly connected to the corresponding inner extension portion; an anchor, located in the internal space and directly connected to the at least one compliant structure, the anchor being connected to the substrate; movable electrodes, located in the internal space and connected to the proof mass; and fixed electrodes, respectively located in correspondence to the movable electrodes, and being connected to the substrate through fixing portions.

Mirco-electro-mechanical system device

The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.

Micro-electro-mechanical system (MEMS) device including an internal anchor area

The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Mirco-electro-mechanical system module and manufacturing method thereof

The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

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Miaoli, Taiwan

Chiung-Cheng Lo