Xmems Labs, Inc.

Xmems Taiwan Co., Ltd.

Chiung C Lo

Wen-Chien Chen

Jemm Yue Liang

Chun-I Chang

David Hong

Martin George Lim

Hao-Hsin Chang

Michael David Housholder

Hsien-Ken Liao

Hai-Hung Wen

Hsi-Sheng Chen

Chao-Yu Chen

Yuan-Shuang Liu

Kuan-Ju Tseng

Jye Ren

Jing-Meng Liu

Chieh-Yao Chang

Lei Chen

JengYaw Jiang

Shun-Nan Tai

Kai-Chieh Chang

Jengyaw Jiang

An electronic device includes an operational component, a heat conductive component and an airflow generating package. The operational component produces a heat while operating. The heat conductive component is configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component. The airflow generating package is disposed by an edge of the electronic device. The airflow generating package includes a film structure, the film structure includes a flap pair, and the flap pair includes a first flap and a second flap. The flap pair operates at an ultrasonic rate to produce an airflow. The heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component.

Electronic device and airflow generating package

A manufacturing method for a device includes: providing a wafer including a first layer and a second layer; forming and patterning an actuating material formed on the wafer; patterning the first layer of the wafer to form a trench line; and removing a first part of the second layer. The first layer forms a film structure including a membrane. A slit is formed within and penetrates through the membrane because of the trench line. The film structure is actuated to form a vent temporarily because of the slit. An ear canal and an ambient of a wearable sound device are to be connected via the vent temporarily opened. The slit divides the membrane into a first membrane portion and a second membrane portion. A difference between the displacements of these two membrane portions is larger than a thickness of the membrane when the vent is formed.

Manufacturing method of device

A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

Sound producing cell

A sound producing package structure includes a plurality of chips disposed within a cavity. The chips includes a first chip and a second chip, the first chip includes a first sound producing membrane and a first actuator attached to the first sound producing membrane, and a second chip includes a second sound producing membrane and a second actuator attached to the second sound producing membrane. The first sound producing membrane and the second sound producing membrane are actuated toward a center of the cavity in a synchronous fashion so as to produce a sound pressure.

Sound producing package structure including sound producing membranes actuated toward cavity center

A venting device includes an anchor structure and a membrane. The membrane is anchored on the anchor structure and configured to form a first vent and a second vent. The membrane includes a first flap, a second flap and a third flap. The membrane partitions a space into a first volume and a second volume, and the first volume and the second volume are connected when the first vent and the second vent are formed. The first flap is actuated to move toward a first direction and the second flap is actuated to move toward a second direction opposite to the first direction, so as to form the first vent. The first flap is actuated to move toward the first direction and the third flap is actuated to move toward the second direction opposite to the first direction, so as to form the second vent.

Venting device, manufacturing method of venting device, venting method and device

A venting device includes a first flap, which is configured to be actuated to swing upward during a rising time, and a second flap, which is disposed opposite to the first flap and configured to be actuated to swing downward during a falling time, a first actuating portion disposed on the first flap, and a second actuating portion disposed on the second flap. The venting device configured to form a vent is disposed within a wearable sound device or to be disposed within the wearable sound device. The vent is formed via applying a first voltage to the first actuating portion and applying a second voltage on the second actuating portion, such that the venting device gradually forms the vent.

Venting device and venting method thereof

An acoustic package structure includes a substrate, a covering structure and an acoustic chip. The covering structure is disposed on the substrate and has a plurality of first openings. The acoustic chip is disposed between the substrate and the covering structure, wherein the acoustic chip includes a membrane.

Acoustic package structure and covering structure

A driving circuit, configured to drive a venting device, includes a first node, a second node, and an amplifying circuit. The venting device, configured to be controlled to open a vent or seal the vent, includes a film structure, which includes a first flap and a second flap, and an actuator, which includes a first actuating portion disposed on the first flap and a second actuating portion disposed on the second flap. When the venting device is controlled to open the vent, the driving circuit generates a first voltage at the first node and generates a second voltage at the second node. When the venting device is controlled to seal the vent, the driving circuit generates a third voltage at both the first node and the second node. The first voltage is larger than the third voltage, and the third voltage is larger than the second voltage.

Driving circuit and wearable sound device thereof

A venting device is disposed within a wearable sound device or to be disposed within the wearable sound device. The venting device includes an anchor structure, a film structure and an actuator. The film structure includes an anchor end anchored on the anchor structure and a free end, and the film structure is configured to form a vent or close the vent. The actuator is disposed on the film structure. The film structure partitions a space into a first volume and a second volume, and the first volume and the second volume are connected via the vent when the vent is formed. The venting device is controlled by the controller to seal the vent when the controller determines to close the vent.

Venting device

An acoustic device includes a first sound producing component and a back cavity structure. The first sound producing component has a first front side and a first back side, wherein the first sound producing component is a high frequency sound unit, and the first front side faces a sound propagating opening of the acoustic device. The back cavity structure is connected to the first back side of the first sound producing component. The first sound producing component produces a first acoustic wave from the first front side towards the sound propagating opening, and the first sound producing component produces a second acoustic wave from the first back side towards a back cavity of the back cavity structure. The back cavity structure is configured to flatten a peak or a dip of a frequency response of the first sound producing component.

Acoustic device and holder flattening frequency response

A cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

Sound producing cell and manufacturing method thereof

A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.

Device, package structure and manufacturing method of device

A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.

Sound producing package structure and manufacturing method thereof

An acoustic impedance measuring system configured to measure an acoustic impedance of an acoustic component includes a first chamber, a second chamber, a first sound pressure sensing device, a second sound pressure sensing device and a sound source. The first sound pressure sensing device is configured to sense a sound pressure in the first chamber. The second sound pressure sensing device is configured to sense a sound pressure in the second chamber. The sound source is connected to the first chamber, wherein the sound source generates a sound propagating towards a first cavity inside the first chamber. The acoustic component is disposed between the first chamber and the second chamber for being measured the acoustic impedance of the acoustic component, and the acoustic impedance of the acoustic component is measured by the first sound pressure sensing device and the second sound pressure sensing device.

Acoustic impedance measuring system and acoustic impedance measuring method

A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

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San Jose, CA, United States of America

Chiung C Lo