Industrial Technology Research Institute

Chiu-Wang Chen

Yung-Feng Nien

Chin-Chong Chiang

Yao-Jiunn Chen

Tai-Kang Shing

Yaw-Nan Lee

Shyuan-Yueh Lin

A method for stacking and bonding wafers in precision alignment by detecting alignment marks provided on wafer edges, comprising the steps of: (a) providing at least a first wafer having at least a first pattern and at least a second pattern disposed on the cross-section thereof, at least a second wafer having at least a third pattern and at least a fourth pattern disposed on the cross-section thereof, and at least a sensing device, while pairing the first pattern with the third pattern and pairing the second pattern with the fourth pattern; (b) actuating the first wafer and the second wafer for enabling the first to parallel the second wafer and to be a distance apart from the second wafer; (c) actuating the first wafer and the second wafer for bringing the two wafers to move toward each other while enabling the sensing device for detecting and determining whether or not the first pattern is in a position capable of matching with the third pattern and the second pattern in another position capable of matching with the fourth pattern; (d) bonding the first wafer and the second wafer while the first pattern matches the third pattern and the second pattern matches the fourth pattern.

Alignment method of using alignment marks on wafer edge

The present invention provides a tactile sensing device comprising a tactile sensing layer, a pressure adjusting unit, at least one pressure sensing unit and a control unit. The tactile sensing layer includes a plurality of elastic elements, each of which has an inner space. The pressure adjusting unit coupled to the tactile sensing layer functions to provide and control variation of the pressure in the inner space of each elastic element. The control unit is coupled to the air supply unit and the at least one pressure sensing unit. The control unit is capable of receiving sensing signal from the at least one pressure sensing unit. In addition, the present invention also provides an apparatus whose surface is covered by the tactile sensing device. With the foregoing disclosure, it is capable of detecting the location and magnitude of the force acted on the tactile sensing device disposed on the surface of the apparatus through sensing the variation of pressure occurred in the elastic elements. Meanwhile, it is also able to change the softness of the tactile sensing device by controlling the air pressure inside the elastic elements.

Tactile sensing device and an apparatus using the same

The invention provides an apparatus for measuring torque of a torque tool by using an indirect structure arranged on one side of the torque tool, in which the apparatus comprises a microstructure part connected with a side surface of the torque tool. The microstructure part further comprises a sensing structure for sensing the strain or displacement generated by a force exerted on the torque tool and converting the strain or displacement into an electrical signal. The electrical signal is then properly calibrated and processed for transforming units by a System-on-Chip (SoC), and converted into the torque value exerted by the user and the value is displayed on a display device.

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Huatan Shiang, Taiwan

Chiu-Wang Chen