Industrial Technology Research Institute

Kneron (taiwan) Co., Ltd.

Chiu-Ling Chen

Sheng-Pan Huang

Hung-Lieh Hu

Ya-Hui Chiang

Ming-Te Lin

Ming-Yao Lin

Chen-Kun Chen

Hung-Hsin Wu

Hsueh-Chih Chang

Bike Xie

Chia-Tai Kuo

Rong-Heng Yuang

Jim-Yong Chi

Fei-Chang Hwang

Kwang-Kuo Shih

Jih-Fu Wang

I-Min Chan

Chien-Chia Chiu

Shang-Ping Ying

Ming-Cheng Wang

Hsuen-Chih Chang

Chuqiao Song

A Fast Non-Maximum Suppression (NMS) Algorithm post-processing for object detection includes getting original data output from a deep learning model inference output, the original data including a plurality of bounding boxes, pre-emptively filtering out at least one bounding box of the plurality of bounding boxes from further consideration when applying the algorithm, the at least one bounding box filtered out according to a predetermined criteria, processing data, using sigmoid functions or exponential functions, from bounding boxes of the plurality of bounding boxes not filtered out to generate processed bounding boxes, calculating final scores of the processed bounding boxes, and choosing a processed bounding boxes utilizing the final scores.

Fast non-maximum suppression algorithm for object detection

An illuminating device is provided. The illuminating device includes a light source and a lampshade. The light source provides a first light beam and a second light beam. The lampshade includes a first curved surface and a second curved surface. The first light beam is refracted by the first curved surface. The second light beam is reflected by the second curved surface, and a curvature of the first curved surface differs from a curvature of the second curved surface.

Illuminating device

An illumination apparatus including a light-emitting unit and a lens module is described. The light-emitting unit is used for generating a light and has a light exit axis. The lens module has a light exit surface with a plurality of curved surfaces. The lens module receives the light and outputs the light from the curved surfaces. Further, the curved surfaces have at least two curvatures, each for adjusting a illumination range of the light output from the corresponding curved surface.

Illumination apparatus

A life test device comprises an oven, a current source, a voltage meter, a control module, and a process module. A light-emitting diode (LED) is disposed in the oven. The temperature of the oven is gradually changed in a first period and remains at a set temperature in a second period. The current source provides a first current and a second current to the LED. The voltage meter measures forward voltages of the LED. The control module controls the current source to output the first or second current to the LED and controls the voltage meter to measure the forward voltages of the LED. The process module calculates a junction temperature of the LED according to the forward voltages and a variation relationship formula between the forward voltages and the temperature of the oven.

Devices and methods for LED life test

A light emitting apparatus at least includes a light emitting device, a connecting wire structure, and a space-occupation body. The light emitting device is disposed in the space-occupation body, electrically coupled with the connecting wire structure, and emits a first-frequency-range light under a suitable driving voltage. A light emitting surface of the light emitting device structure is covered by a first anti-reflection layer with respect to the first-frequency-range light. A packaging material is filled into the space-occupation body. The packaging material at least includes a luminescent material. The luminescent material is excited by the first-frequency-range light, so as to generate at least a second-frequency-range light. A reflector is disposed on the light emitting surface of the light emitting apparatus, such that the first-frequency-range light is totally or mostly reflected back to the space-occupation body omni-directionally, and the excited second-frequency-range light passes through the reflector.

Phosphor-based LED apparatus with UV reflector

A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

Light emitting diode package and process of making the same

A bar-like side-emitting light guide suitable for re-directing an incident light beam such that the light beam emerges from each side of the structure. The guide structure includes a light guiding bar having an upper surface and a lower surface and extending along a longitudinal direction. On a cross-sectional plane of the light guiding bar, there is a first line interval on the upper surface. A second line interval, a third line interval and a coupling part are located at the lower surface. The coupling part couples with the second line interval and the third line interval. The distance from the lower surface of the light guiding bar to a reference plane of the upper surface varies such that the thickness gradually decreases from the coupling part to the sides. In addition, a planar light source module can be constructed by arranging the foregoing light guiding bars in parallel.

Structure of bar-like side-emitting light guide and planar light source module

A high efficiency white light emitting diode, having a light emitting diode chip, a transparent substrate, a transparent Ohmic electrode, a reflection layer, a contact diode and covered with submount with a conductive trace. The transparent substrate having a rough surface is disposed on a first surface of the chip. The transparent Ohmic electrode is disposed on a second surface of the chip and coupled with the contact electrode. The submount with the conductive trace used to carry the chip has a high thermal conductivity. The conductive trace is electrically connected to the contact electrode on the chip by soldering material. The surface of the chip is covered with fluorescent paste to absorb a portion of the light generated by the light emitting diode and to emit a complementary light, so that the observer can observe a white light.

High efficiency white light emitting diode

A self-aligned method for fabricating a ridge-waveguide semiconductor laser uses two photoresist layers in the process. The lower one is photoresist ODUR1013, and the upper one is photoresist AZ5214E. The lower photoresist layer, ODUR1013, can only be developed by light of wavelength less than 300 nm, and the upper photoresist layer, AZ5214E, can only be developed by light of wavelength greater than 300 nm. In the process of forming an opening on the top of the ridge structure, a G-line mask aligner is used to develop the upper photoresist AZ5214E and to expose the lower photoresist ODUR1013. Then, by performing a reactive ion etching (RIE) process, the lower photoresist ODUR1013 and the dielectric within the opening are removed. The remains of the upper photoresist layer, AZ5214E, are used to protect the sidewalls of the ridge structure in the RIE process.

Growing community of inventors

Hsinchu County, Taiwan

Chiu-Ling Chen