Motorola Corporation

Chiu Chik Chen

Robert Charles Kosberg

Lawrence R Poglitsch

Christopher J Hoyle

Keith A Meny

James Lee Nowicki, Jr

An electrical device (10) includes a package body (12) having a device mounting region (14) and an electrical connection region (16). A cavity (18) resides in the package body (12) intermediate to the device mounting region (14) and to the electrical connection region (16). A leadframe (20) is positioned within the package body (12) and includes a plurality of individual leads (34) traversing the cavity (18). An electronic component (24) is electrically attached to the individual leads (34) within the cavity (18). In addition to accommodating the attachment of the electronic component (24), the cavity (18) is configured to permit access to the individual leads (34) by a bonding tool (40).

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Lincolnwood, IL, United States of America

Chiu Chik Chen