Texas Instruments Corporation

Chittranjan Mohan Gupta

Rajen Manicon Murugan

Jie Chen

Django Trombley

Gary Paul Morrison

Stanley Craig Beddingfield

Kenneth Robert Rhyner

Minhong Mi

Yiqi Tang

Tianyi Luo

In examples, a semiconductor package comprises a substrate and multiple columns of semiconductor dies positioned approximately in parallel along a length of the substrate. The package also includes multiple passive components positioned between the multiple columns of semiconductor dies, the multiple passive components angled between 30 and 60 degrees relative to the length of the substrate, a pair of the multiple passive components having a gap therebetween that is configured to permit mold compound flow through capillary action. The package also includes a mold compound covering the substrate, the multiple columns of semiconductor dies, and the multiple passive components.

Passives to facilitate mold compound flow

An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Growing community of inventors

Richardson, TX, United States of America

Chittranjan Mohan Gupta