Nippon Paint Compnay, Ltd.

Ajinomto Co., Inc.

Chitoshi Kawaguchi

Kazunori Kanda

Seiji Arimatsu

Toshitaka Kawanami

Yasushi Umeda

Koichi Kimoto

Koji Takeuchi

Masao Honma

Katsuji Konishi

Osamu Nanba

Yasuhiro Kimura

Atsushi Mashita

Syoichi Asada

The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises:

Process for exposing a photosensitive resin composition to light

Disclosed herein is a polyether acrylamide derivative of the following general formula (I): ##STR1## as well as an active energy ray curable resin composition comprising at least one polyether acrylamide derivative of the above general formula (I) and a cured product produced by curing such an active energy curable resin composition with active energy rays.

Polyether acrylamide and active energy ray curable resin composition

Disclosed is a photosensitive resin composition which, can be hot melt molding and and is water-developable. The composition does not need the preliminary exposure process and when cured has suitable hardness and printing properties. The photosensitive resin composition comprises;

Photosensitive resin composition

Disclosed is a water-developable photosensitive resin composition capable of hot melt molding, which comprises:

Water developable photosensitive resin composition, and resin or

Water-developable photosensitive resin composition and resin or printing

Growing community of inventors

Soraku, Japan

Chitoshi Kawaguchi