Laird Connectivity, Inc.

Laird Technologies Gmbh

Molex Cvs Grand Blanc, LLC

Laird Technology, Inc.

Chit Yong Hang

Kok Jiunn Ng

Hasan Yasin

Michael McGinnis

Joseph Michael Combi

Kean Meng Lim

Choon Chung Su

Brian E Petted

Wei Tat Ng

William Steinike

Kok Min Ong

Azlan Shah Md Desah

Jonathan Cleston Harris White

Yen Siang Tan

Exemplary embodiments are provided of molding designs and methods for helical antennas. In an exemplary embodiment, a method generally includes placing an antenna element between a top mold core and a first bottom mold core, and injecting molding material into a first mold cavity defined by at least the top mold core, thereby forming a top portion of a helical antenna housing and two opposite side portions of the helical antenna housing. The method also includes removing the first bottom mold core and placing a second bottom mold core about the antenna element, and injecting molding material into a second mold cavity defined by at least the second bottom mold core, thereby forming a bottom portion of the helical antenna housing.

Molding designs for helical antennas

Exemplary embodiments are disclosed of dual-band multiple-input multiple-output (MIMO) antennas. In an exemplary embodiment, an antenna generally includes a circuit board, a first antenna radiating element positioned on the circuit board, a second antenna radiating element positioned on the circuit board, and at least two antenna feeding elements extending from the circuit board. Each of the at least two antenna feeding elements is electrically connected with a different one of the first and second antenna elements.

Dual band multiple-input multiple-output antennas

Exemplary embodiments are provided of antenna housing assemblies. In an exemplary embodiment, an assembly generally includes a radome having an outer surface, an inner surface, a first end, and a second end opposite the first end. A top cap is coupled to the first end of the radome via an ultrasonic weld joint. A first sealing member is disposed about the top cap such that the first sealing member is positioned between the top cap and the inner surface of the radome. A bottom cap is fastened to the second end of the radome via an ultrasonic weld joint. A second sealing member is disposed about the bottom cap such that the second sealing member is positioned between the bottom cap and the inner surface of the radome. Exemplary methods of assembling antenna housings are also disclosed.

Antenna housing assemblies and methods of assembling antenna housings

Disclosed are exemplary embodiments of a low profile wideband and/or multiband omnidirectional antennas. In an exemplary embodiment, an antenna generally includes a radiator and a ground plane. The ground plane may include a slanted surface along or defining an edge portion of the ground plane. The slanted surface may be configured to be operable for reducing null at azimuth plane to thereby allow the antenna to have more omnidirectional radiation patterns for the azimuth plane. In another exemplary embodiment, an antenna generally includes a substrate, a radiator along the substrate, and electrically-conductive tape or foil defining at least part of a ground plane. The electrically-conductive tape or foil is coupled to a ground of the radiator via proximity coupling and electrically insulated by masking of the substrate.

Low profile omnidirectional antennas

According to various aspects, exemplary embodiments are disclosed of antenna assemblies and methods of manufacturing the same. In an exemplary embodiment, a method generally includes forming (e.g., molding, etc.) a sleeve over and/or between a first portion of a first component (e.g., a bushing, etc.) and a second portion of a second component (e.g., adaptor, etc.). The sleeve is coupled to the first and second portions of the respective first and second components. The method may also include removably attaching an antenna connector subassembly to the first component such that a printed circuit board assembly of the antenna connector subassembly is covered by the sleeve. The method may additionally include overmolding a sheath over the sleeve and one or more radiating elements of a multiband antenna assembly that includes the antenna connector subassembly, whereby the sleeve covers and protects the printed circuit board assembly during the overmolding.

Antenna assemblies and methods of manufacturing the same

Growing community of inventors

Penang, Malaysia

Chit Yong Hang