Honda Motor Co., Ltd.

Chiriki Watanabe

Koji Watanabe

Yushi Shinno

Yusuke Takamura

Yasushi Arahata

A resin molding systemcomprises a gripping deviceprovided with a gripping framefor gripping a resin sheet material, a heating device for heating the resin sheet materialand a molding device for clamping a lower dieand an upper die, and affixing the resin sheet materialto a substrate. The molding device is provided with: a lowering device for lowering the gripping deviceand causing the resin sheet materialgripped by the gripping frameto approach the lower die; and a pair of bent postswhich are provided on both Y-direction sides of the lower die, and which come in contact with portions of the gripping framewhen the gripping deviceis lowered, and which convexly bend the gripping frameupward as viewed from the side along the Y-direction.

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Tochigi, Japan

Chiriki Watanabe