Pitney Bowes Inc.

Chipping Sye

Peter T Collings

Jason P Paradis

Jihad Abdul-Rahiim

A moistening device that significantly reduces any loss of contact between the applicator and envelope flap regardless of the thickness of the mail piece or size of the flap, thereby ensuring sufficient wetting of the glue line on the envelope flap with moistening fluid, is provided. A deflection device is added to a portion of the support to which the applicator is secured. The deflection device is located and sized to exert a force on the applicator, causing the applicator to form into a shape that more closely matches the shape of an envelope flap being processed, while also allowing the applicator to flex slightly in multiple directions. This results in little to no loss of contact between the applicator and glue line on the envelope flap, thereby allowing sufficient moistening fluid to be transferred from the applicator to the glue line.

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Stamford, CT, United States of America

Chipping Sye