Intel Corporation

Apple Inc.

Chintan S Thakkar

Bryan K Casper

Kaushik Dasgupta

Anandaroop Chakrabarti

James E Jaussi

Stefano Pellerano

Stefan Shopov

Kameran Azadet

Shilpa Talwar

Hosein Nikopour

Ofir Degani

Wook Bong Lee

Ashoke Ravi

Michael Genossar

Claudio Da Silva

Debabani Choudhury

Rotem Banin

Albert Molina

Sidharth Dalmia

Georgios Yorgos Palaskas

Igal Kushnir

Duncan Kitchin

Saku Lahti

Oner Orhan

Emanuel Cohen

Mikko S Komulainen

Chuanzhao Yu

Gadi Shor

Jayprakash Thakur

Eren Sasoglu

Arnaud Lucres Amadjikpe

Kunal Datta

Menashe Soffer

Ana M Yepes

Run Levinger

Omer Asaf

Moshe Teplitsky

Eshel Gordon

Erkan Alpman

Nebil Tanzi

Josef Hagn

Ron Pongratz

Tawfiq Musah

Baljit Singh

Peter Sagazio

Eyal Goldberger

Amit Freiman

Shuhei Yamada

Hyun Yoon

Yossi Tsfati

Eran Gerson

Shmuel Ravid

Marian K Verhelst

Meir Gordon

Resti Montoya Moreno

Noam Kogan

Nir Weisman

Ra'anan Sover

Mikko M Lampinen

Miroslav Baryakh

Naftali Landsberg

Avi Tsarfati

Lior Shakedd

Anat Bazov

Stefano Brenna

Saeid Daneshgar Asl

Amr M Fahim

Shinwon Kang

Saeid Daneshgar

Te Yu Kao

Nathan G Narevsky

Gregory Chance

Xi Li

Shreyas Sen

Cooper S Levy

Brandon Davis

Telesphor Kamgaing

Brian S Leibowitz

Georgios C Dogiamis

Henning Braunisch

Jose A Tierno

Sanjeev K Maheshwari

Gregory W Chance

Neelam Prabhu Gaunkar

Brandon R Davis

Diego Correas-Serrano

Haiming Jin

An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.

Millimeter wave transmitter design

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Wireless communication technology, apparatuses, and methods

Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

Dispersive waveguide crosstalk mitigation

To compensate for intersymbol interference, a serial data receiver circuit included in a computer system may include an equalizer circuit that includes a digital-to-analog converter circuit. Based on previously received symbols, the equalizer circuit modifies a signal received via a communication channel or link prior to clock and data recovery. In cases when the digital-to-analog converter circuit becomes saturated, the equalizer circuit additionally uses a dither signal to modify the received signal.

Serial data receiver circuit with dither assisted equalization

Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.

Waveguides including at least one ridge associated with at least one dielectric core and the waveguides are surrounded by a conductive shell

A digital transmitter architecture is disclosed to transmit (TX) multi-gigabit per second data signals on single carriers (SC) or orthogonal frequency division multiplexing (OFDM) carriers at millimeter wave frequencies in either one of a high-resolution modulation mode or a spectral shaping mode. The architecture includes a number of digital power amplifier (DPA) and modulation reconfigurable circuit segments to process individual bits of a data bit stream in parallel according to a specific circuit configuration corresponding to the selected TX mode using a multiplexer to switch between configurations.

Ultra-high data rate digital mm-wave transmitter with energy efficient spectral filtering

Embodiments of the present disclosure provide apparatuses and systems for proximity communications. The apparatus may include an integrated circuit (IC) package with a central processing unit (CPU) circuit, an input-output (I/O) circuit coupled with the CPU circuit, and a dielectric electromagnetic waveguide coupled with the I/O circuit, to enable communications between the CPU circuit and another apparatus. In another instance, the apparatus may include a plurality of coupler pads disposed on a first surface of the apparatus; and a processor electrically coupled with the coupler pads. One of the coupler pads may form capacitive coupling with one of coupler pads disposed on a second surface of another apparatus, in response to a placement of the first surface in at least partial contact with the second surface, to enable proximity data communication between the processor and the other apparatus. Other embodiments may be described and/or claimed.

Techniques for device-to-device communications

Techniques for forming high-bandwidth proximity connection between capacitively coupled plug and receptacle are described herein. A system for achieving capacitive coupling between contactless pads is described. The techniques include aligning and retaining the plug and receptacle in close proximity to one another. The techniques include cancelling crosstalk in the system based on the symmetry and orientation of differential pairs comprising signal pads. The techniques include enabling a high-bandwidth proximity transmission by filtering the transmission using a silicon buffer component.

Proximity capacitive coupling for board-to-board wide bandwidth transmissions

Growing community of inventors

Portland, OR, United States of America

Chintan S Thakkar