Sibeam, Inc.

Lattice Semiconductor Corporation

Ubistar Technology, Inc.

Milliwave Silicon Solutions, Inc.

Qualcomm Incorporated

Chinh Doan

Nishit Kumar

Mark Graham Forbes

Sohrab Emami

Brian Henry John

Dmitry Cherniavsky

James Ray Parker

Sohrab Emami-Neyestanak

Ricky Keangpo Ho

Shi Cheng

Nitesh Singhal

Ron Zeng

David Noel Babbage, Ii

JeanMarc Laurent

Patrick Thomas McElwee

John Marshall

Jeffrey M Gilbert

Ada Shuk Yan Poon

Chuen-Shen Bernard Shung

Tim Williams

Xiang Guan

Robert W Brodersen

Wen Fan

Mohammed Ershad Ali

Bernard Shung

Embodiments herein relate to a testing apparatus for coupling with a device-under-test (DUT). The apparatus may include a base portion configured to couple to a testing platform, wherein the base portion is configured to rotate the DUT around a first axis. The apparatus may further include an arm portion configured to rotate the DUT around a second axis perpendicular to the first axis. The apparatus may further include a platform portion configured to couple to the DUT. Other embodiments may be described and claimed.

Multi-axis test equipment

Embodiments herein provide a test apparatus and system for a millimeter wave reflection test to measure propagation of millimeter wave signal through a material at various incident angles. In one example, the test apparatus may include a mechanized arch over a base plate, the mechanized arch including antenna carriers coupled to the mechanized arch and configured to hold respective antennas. A motor assembly moves the antenna carriers along the mechanized arch while maintaining the antenna carriers at symmetrical (equal and opposite) angles with respect to the base plate.

Millimeter wave reflection test apparatus

Disclosed wireless tunneling system includes two wireless tunneling apparatuses that communicate with each other through the wireless link. A local wireless tunneling apparatus is coupled to a local processing apparatus through a wired connection and a remote wireless tunneling apparatus is coupled to the remote processing apparatus through another wired connection. The two processing apparatuses bi-directionally communicate with each other through the wireless link using the two wireless tunneling apparatuses as if the two processing apparatuses were connected through a wired connection.

Full duplex radio in wireless tunneling system

A disclosed wireless tunneling system tunnels communications between two processing apparatuses through a wireless link, while maintaining compliance of the communications between the two processing apparatuses with a wired communication protocol. In one embodiment, the wireless tunneling system includes two wireless tunneling apparatuses that communicate with each other through the wireless link. A local wireless tunneling apparatus is coupled to a local processing apparatus through a wired connection and a remote wireless tunneling apparatus is coupled to the remote processing apparatus through another wired connection. In one aspect, the local wireless tunneling apparatus predicts a state of the remote processing apparatus, and mirrors the predicted state of the remote processing apparatus. Mirroring the state based on the prediction enables high speed data rate tunneling between the two processing apparatuses through the wireless link without a delay associated with the wireless tunneling apparatuses affecting the high speed data rate tunneling.

Multi-gigabit wireless tunneling system

A wireless tunneling system tunnels communications between a first host device and a second host device through a wireless link, while maintaining compliance of the communications between the first and second host devices with a wired communication protocol and operates in a power efficient manner. Two host devices may communicate with each other through a wireless link using the wireless tunneling system, as if two host devices were connected through the wired cable. The wireless tunneling system operates in one of a high power state and one or more low power states. In the high power state, the wireless tunneling system exchanges data at a higher data rate for tunneling. In the low power state, the wireless tunneling system disables power hungry components for conserving power.

Low power operations in a wireless tunneling transceiver

A device has an RF mixer, an IF mixer module, a single synthesizer, a frequency divider, a single side band mixer and a frequency quadrupler. The single synthesizer generates a signal to the IF mixer module, the frequency divider, and the single side band mixer. The single side band mixer mixes signals from the single synthesizer and the frequency divider. The frequency quadrupler receives the output of the single side band mixer. The RF mixer is coupled to the frequency quadrupler and the IF mixer module.

Wireless architecture for 60GHZ

A circuit features a balun having an unbalanced input and a balanced output, and a differential coupler having a symmetrical structure about a center axis. The differential coupler has a differential input and a differential output, the differential input being coupled to the balanced output of the balun. An impedance element is coupled to a circuit node of the differential coupler at a point along the center axis. Other embodiments are also described and claimed.

Multi-transformer architecture for an active RF circuit

A method and apparatus is disclosed herein for wireless communication with adaptive beamforming. In one embodiment, the apparatus comprises a processor, a radio frequency (RF) transmitter having a digitally controlled phased array antenna coupled to and controlled by the processor to transmit content using adaptive beamforming, and an interface to a wireless communication channel coupled to the processor to communicate antenna information relating to the use of the phased array antenna and to communicate information to facilitate playing the content at another location.

Wireless communication device using adaptive beamforming

An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.

Surface mountable integrated circuit packaging scheme

Growing community of inventors

San Jose, CA, United States of America

Chinh Doan