Raydium Semiconductor Corporation

Ching-Yung Chen

Wen-Tsung Lin

Po-Cheng Lin

A package structure applied to a driving apparatus of a display is disclosed. The driving apparatus includes at least one driving unit. The package structure includes a substrate, a first connecting unit, a second connecting unit and at least one package unit. The substrate is used to carry the driving unit. The first connecting unit is disposed at one side of the substrate. A longitudinal direction of the first connecting unit is parallel to a first direction. The second connecting unit is disposed at the other side of the substrate. A longitudinal direction of the second connecting unit is parallel to the first direction. The package unit is used to package the driving unit to form driving unit package object. A longitudinal direction of the driving unit package object is parallel to a second direction. The first direction and the second direction are perpendicular to each other.

Package structure applied to driving apparatus of display

A double-sided chip on film (COF) packaging structure and a manufacturing method thereof are disclosed. The double-sided COF structure includes a metal layer, a first insulating layer, a second insulating layer, a chip, and an encapsulant. The first insulating layer and second insulating layer are disposed on a first surface and a second surface of metal layer respectively. The first surface and second surface are opposite. The first insulating layer includes a first part and a second part separated from each other. An accommodating space is existed between the first part and the second part and a part of the first surface is exposed. The chip is accommodated in the accommodating space and disposed on the exposed part of the first surface. The encapsulant fills the spaces between the chip and the first part and between the chip and the second part to form the double-sided COF packaging structure.

Double-sided chip on film packaging structure and manufacturing method thereof

The invention discloses a package structure of a driving apparatus of a display. The driving apparatus of the display includes a plurality of driving units. The package structure includes a substrate and a plurality of package units. The substrate is used to carry the plurality of driving units. The plurality of driving units is apart to each other. The plurality of package units is used to package the plurality of driving units respectively to form a plurality of driving unit package body apart to each other. A total output channel number of the driving apparatus of the display equals to a total channel number of the plurality of driving units. This package structure can avoid heat concentration on the driving apparatus of the display to achieve good cooling effect and output effectiveness of the driving apparatus of the display will be not reduced accordingly.

Growing community of inventors

Taoyuan, Taiwan

Ching-Yung Chen