Quanta Computer Incorporated

Ching-Yi Shih

Yi-Chieh Chen

Yueh-Chang Wu

Kang Hsu

Chao-Jung Chen

Po-Cheng Shen

A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Combination heat sink

A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

Dust proof system with filter module

A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Systems and methods for heat dissipation in computing systems with environment resistance

A cooling assembly includes a primary plate, a secondary plate, and a padding layer. The primary plate includes a body, a first arm, and a second arm. The first arm and the second arm of the primary plate extend outwardly in opposite directions from the body of the primary plate. The secondary plate also includes a body, a first arm, and a second arm. The first arm and the second arm of the secondary plate extend outwardly in opposite directions from the body of the secondary plate. The padding layer is inserted between the primary plate and the secondary plate. The padding layer directly contacts a heat-generating electrical component secured between the primary plate and the secondary plate.

Memory cooling system in a server

Systems and methods are provided for controlling two or more PSUs of a server system. An exemplary method comprises first determining whether the PSUs are switched on to an AC power source. If the PSUs are found not switched on to an AC power source, the method further comprises restarting the AC power source for the PSUs and completing a software-based recovery process. If the PSUs are found to be switched on to an AC power source, the method further comprises determining whether the PSUs meet a predefined criterion. If the PSUs do meet a predefined criterion, the method further comprises disabling a cold-redundancy mode for the PSUs. If the PSUs do not meet a predefined criterion, the method further comprises starting a wake-up process for a first PSU from a cold-redundancy mode.

Growing community of inventors

Taoyuan, Taiwan

Ching-Yi Shih