Wistron Neweb Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Au Optronics Corporation

Formosa Plastics Corporation

Memocom Corp.

Ching-Wen Chen

Ming-Che Ho

Long-Tyan Hwang

Kun-Yeh Tsai

Chia-Chi Hung

Wen-Ju Chou

Hung-Jui Kuo

Chia-Hao Chang

An-Thung Cho

Shih-Hua Hsu

Cheng-Wei Chiang

Ying-Hui Lai

Chia-Chun Hsieh

Chung-Shi Liu

Ming-Da Cheng

Chih-Wei Lin

Wen-Hsiung Lu

Yi-Wen Wu

Chui-Ya Peng

Chun-Hsu Yen

Wen-Chieh Lee

Chun Huan Chang

Wei-Han Chen

Chia-Tung Chang

Bang-Yu Huang

Meng-Kai Wu

Hong-Gee Fang

Chih-Chun Peng

Hao-Lun Hsieh

Shuo-Yang Sun

Ting-Han Shih

Cheng-Rui Zhang

Wei-Chieh Wu

Chia-Hua Chiang

Chung-Che Lien

Rong-Ann Lin

Shi-Jie Lin

Yen-Liang Wu

Ming-I Huang

A manufacturing method for a carbon fiber includes: performing an emulsification step that includes uniformly mixing a silicone oil composition and an emulsifier to form an oiling agent, in which the silicone oil composition includes γ-divinyltriamine propylmethyldimethoxyl silane and N-(β-aminoethyl)-γ-aminopropylmethylbimethoxy silane; performing an oiling step that includes soaking a carbon raw filament in the oiling agent, such that the oiling agent is adhered to a surface of the carbon raw filament to form a carbon fiber precursor; and performing a calcination step on the carbon fiber precursor, such that the carbon fiber is formed.

Manufacturing method for carbon fiber

A water washing device for carbon fiber filament and a method of water washing using the same are provided. The water washing device divides a temperature controller and the carbon fiber filament by disposing a division plate in a water washing tank; thus a temperature of washing water can be accurately controlled. Further, spray nozzle(s) can be controlled to enhance washing effect of the carbon fiber filament.

Water washing device for carbon fiber filament and method of water washing

An optoelectronic tweezer device includes a transparent substrate, a semiconductor layer, a first electrode and a dielectric layer. The semiconductor layer is located above the transparent substrate and includes a first doping region, a second doping region and a transition region, wherein the transition region is located between the first doping region and the second doping region. The first electrode is located on the first doping region and is electrically connected to the first doping region. The dielectric layer is located above the semiconductor layer and has a first through hole overlapping the first electrode.

Optoelectronic tweezer device and fabrication method thereof

A semiconductor structure and a method of forming the same are disclosed. A method of forming a semiconductor structure includes the following operations. An insulating layer is formed over a substrate. A metal feature is formed in the insulating layer. An argon-containing plasma treatment is performed to the insulating layer and the metal feature.

Semiconductor structure and method of forming the same

The present invention relates to a method for producing a carbon fiber. In the method for producing the carbon fiber, a high pure acrylonitrile monomer with specific contents of impurities and a comonomer are used to produce an acrylonitrile copolymer, and the acrylonitrile copolymer is subjected to a spinning operation, a stretching operation, an oxidation treatment and a carbonization treatment in sequence, for obtaining the carbon fiber. The acrylonitrile copolymer with an appropriate falling-ball viscosity and an appropriate weight-average molecular weight is beneficial to the spinning operation, thereby reducing an inner pore diameter and enhancing strength of the resulted carbon fiber.

Method for producing carbon fiber

Carbon fiber and method of forming the same are provided. The method modifies proportion of a finishing oil to control a relation between a surface tension and a particle size of the finishing oil, and thus penetration of the finishing oil into an interior of the carbon fiber is avoided. Therefore, the carbon fiber can have both low oil residues and a high strength.

Carbon fiber and method of forming the same

A mobile device includes an NFC (Near Field Communication) antenna including a metal coil and a first dielectric substrate, a coupling metal element, and a second dielectric substrate. The metal coil is disposed on the first dielectric substrate. The coupling metal element is adjacent to the metal coil. The coupling metal element does not directly touch the metal coil. The coupling metal element is disposed on the second dielectric substrate. The coupling metal element is configured to adjust the operational frequency of the NFC antenna.

Antenna system

An organic semiconductor substrate includes a base, a first conductive pattern, a second conductive pattern, a first metal oxide pattern, a second metal oxide pattern, an organic flat pattern layer, a source, a drain, an organic semiconductor pattern, an organic gate insulating layer, and a gate. The first conductive pattern and the second conductive pattern are disposed on the base and separated from each other. The first metal oxide pattern and the second metal oxide pattern respectively cover and are electrically connected to the first conductive pattern and the second conductive pattern, respectively. A first portion of the organic flat pattern layer is disposed between the first metal oxide pattern and the second metal oxide pattern. A surface of the first metal oxide pattern has a first distance from the base. A surface of the first portion of the organic flat pattern layer has a second distance from the base. The second distance is less than or equal to the first distance.

Organic semiconductor substrate

An electronic device and an antenna structure thereof are provided. The antenna structure includes a first, a second and a third radiating element and a grounding element. The first radiating element includes a first and a second radiating portion, a feeding portion and a grounding portion. The grounding portion includes a first, a second, a third, a fourth and a fifth section. The first section is connected between the first radiating portion and the feeding portion. The grounding element is connected with the fourth section and the fifth section. The second radiating element is connected with the grounding element. The second radiating element includes a third radiating portion, and the third and the second radiating portion are coupled with each other. The third radiating element is connected with the feeding portion, and the third radiating element and the first section are coupled with each other.

Electronic device and antenna structure thereof

An antenna structure and an electronic device are provided. The antenna structure includes a first radiating member, a second radiating member, a grounding member, and a capacitance element. The first radiating member includes a first radiating part, a second radiating part, a feeding part, and a grounding part. The second radiating member is coupling to the first radiating member. The second radiating member includes a third radiating part and a main body part that are connected to each other. There is a first predetermined length between a feeding point of the feeding part and an open end of the second radiating part. There is an electrical length between a connection point where the main body part is electrically connected to the capacitance element and an open end of the third radiating part. The electrical length is greater than the first predetermined length.

Antenna structure and electronic device

A semiconductor package and a method of forming the same are disclosed. A method of forming a semiconductor package includes the following operations. A polymer layer is formed over a die. A metal feature is formed in the polymer layer. An argon-containing plasma treatment is performed to the polymer layer and the metal feature.

Semiconductor package and method of forming the same

A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.

Communication device and communication method

A mobile device including a metal housing, a substrate, a grounding metal element, a first radiation element, a second radiation element, and a switch element is provided. The metal housing includes a body portion and a slot disposed on the body portion. The substrate is disposed on the metal housing. The grounding metal element is disposed on the metal housing and coupled to the metal housing. The switch element is disposed on the substrate, and the switch element is coupled between the second radiation element and the grounding metal element. When the switching element is switched to a first mode, a first radiation pattern is generated by the first radiation element and the second radiation element, when the switching element is switched to a second mode, a second radiation pattern is generated by the first radiation element and the second radiation element.

Mobile device

A mobile device includes a metal back cover, a dielectric substrate, a grounding metal element, a first radiation element, and a second radiation element. The metal back cover has a slot. The dielectric substrate has a first surface and a second surface, and the second surface faces the slot. The grounding metal element extends onto the first surface of the dielectric substrate. The first radiation element has a feeding point, and is disposed on the first surface of the dielectric substrate. The first vertical projection of the first radiation element at least partially overlaps the slot. The second radiation element is disposed on the second surface of the dielectric substrate. The second vertical projection of the second radiation element at least partially overlaps the slot. An antenna structure is formed by the first radiation element, the second radiation element, and the slot of the metal back cover.

Growing community of inventors

Hsinchu, Taiwan

Ching-Wen Chen