Coretronic Corporation

Ching-Tai Tseng

Hui-Chuan Chen

Yi-Hsing Peng

A bonding method for an electronic element includes attaching a solder film to a display substrate and covering multiple bonding pads, performing a heat treatment step so that a solder layer on the multiple bonding pads is transformed into multiple solder bumps, providing at least one electronic element and covering the solder bumps, and heating the solder bumps to electrically bond the at least one electronic element and the bonding pads. The display substrate includes multiple display panels, a first adhesive layer, and a glass cover. The first adhesive layer and the glass cover are disposed on one side of the display panel away from the bonding pads. During the bonding process of the at least one electronic element and the bonding pads, no pressure is applied between the at least one electronic element and the bonding pads.

Bonding method for electronic element

A light source module includes a light guide plate, a light source, a first inverse prism sheet and a second inverse prism sheet. The light guide plate has a light incident surface and opposite first light exit surface and second light exit surface. The first inverse prism sheet is disposed beside the first light exit surface, and has a first bearing surface and a plurality of first prisms. Each of the first prisms has a first surface. A first included angle is formed between the first surface and the first bearing surface. The second inverse prism sheet is disposed beside the second light exit surface, and has a second bearing surface and a plurality of second prisms. Each of the second prisms has a second surface. A second included angle is formed between the second surface and the second bearing surface. A dual display device is also provided.

Growing community of inventors

Hsin-Chu, Taiwan

Ching-Tai Tseng