Epistar Corporation

Yenrich Technology Corporation

Semileds Optoelectronics Co., Ltd.

Ching-Tai Cheng

Yih-Hua Renn

Min-Hsun Hsieh

Wei-Shan Hu

Chun-Hua Shih

Lung-Kuan Lai

Shau-Yi Chen

Shih-An Liao

Pei-Hsuan Lan

Ming-Chi Hsu

Tsung-Hong Lu

Ju-Lien Kuo

Hsin-Mao Liu

Chun-Hung Liu

Jui-Kang Yen

Aurelien Gauthier-Brun

Yu Chen Liao

Jhih-Hao Chen

Chong-Yu Wang

Trung Tri Doan

Ya-Wen Lin

Chi-Chih Pu

Tzu-Hsiang Wang

Yung-Wei Chen

Ying-Yong Su

Guan-Wu Chen

Yu-Hsi Sung

Hsuan-Tzu Peng

Pao-Yu Liao

Wen-Chien Wu

Hsiao-Pei Chiu

A light-emitting device includes a circuit carrier board having a short side and a long side, a plurality of light-emitting units on the circuit carrier board for emitting three or more color lights, and a light-transmitting glue layer on the circuit carrier board and covering the plurality of light-emitting units. The short side is shorter than the long side. The plurality of light-emitting units include a first light-emitting unit. The first light-emitting unit has a light exit surface, a first sidewall, and a second sidewall. The first sidewall faces the short side and has a first included angle with the light exit surface, and the second sidewall faces the long side and has a second included angle with the light exit surface. The first included angle is between 85 to 95 degrees, and the second included angle is less than 85 degrees or greater than 105 degrees.

Light-emitting device and display device

A light-emitting device comprises a light-emitting element, a covering structure, a quantum dot material block, and an adhesive structure is disclosed. The covering structure has a depressed part. The quantum dot material block is filled into the depressed part and enclosed by the light-emitting element and the covering structure. The light-emitting element, the covering structure, and the quantum dot material block are bonded together through the adhesive structure. Since the quantum dot material block is enclosed by the covering structure and the light-emitting element, the outer moisture and oxygen are blocked by the covering structure and the light-emitting element from the quantum dot material block, the decreasing emitting efficiency of the quantum dot material is further alleviated.

Light-emitting device and manufacturing method thereof

A display device includes a first light-emitting module and a second light-emitting module. Each light-emitting module has a substrate, a plurality of LED dies arranged on the substrate, a reflective layer on the substrate, and a light-transmissive layer. The light-transmissive layer covers the substrate, the plurality of LED dies, and the reflective layer. Both the light-transmissive layer of the first module and the light-transmissive layer of the second module have rough uppermost surfaces. The first light-emitting module has a first reflectivity, the second light-emitting module has a second reflectivity, and a standard deviation between the first reflectivity and the second reflectivity is not greater than 0.5.

LED display device

A backlight module is provided. The backlight module includes a substrate having a substrate surface, a conductive layer disposed on the substrate surface, a plurality of LED chips disposed on and electrically connected to the conductive layer, a light-permeable layer having a light-permeable surface away from the substrate surface, and a pattern layer disposed on the light-permeable surface and having a plurality of first patterns corresponding to and respectively located above the plurality of LED chips. Wherein, each first pattern has a maximum width. A maximum width of one first pattern satisfies the following formula:&#x2265;2()(1&#x2212;1/);wherein Wis the maximum width of one first pattern, n is a refractivity of the light-permeable layer, Tis a thickness of the light-permeable layer, Tis a thickness of the LED chip, Wis a maximum width of LED chip corresponding to the first pattern.

Backlight module

The light-emitting diode package includes a plurality of bumps being a couple corresponding to each other. Each of the bumps has a first part and a second part placed under the first part, and a gap is formed between the bumps in a period-repeating wriggle shape or an irregular wriggle shape. Accordingly, the distance between the bumps of the light-emitting diode package is small, which results in a less stress being concentrated at the space between the bumps, as a result, a crack is difficultly caused by the stress to the light-emitting diode package, in other words, the structural strength between the bumps and the covering part is enhanced. Still, while being manufactured, the yield rate of the light-emitting diode package is also improved since there is almost no crack to reduce the yield rate.

Light-emitting diode package having bump formed in wriggle shape

Light-emitting device having two light-emitting areas

A LED package comprises an LED chip, a reflective structure which encloses the LED chip, a wavelength conversion structure placed on the LED chip, and an absorbing structure which encloses or is placed on the reflective structure.

LED package

The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.

A light-emitting device includes a light-emitting element having a first electrode and a second electrode, a carrier, a first contact and a second contact. The first contact is arranged on the carrier and is electrically connected to the first electrode. The second contact is arranged on the carrier and is electrically connected to the second electrode. The first contact has a contour similar with that of the first electrode. The second contact has a contour similar with that of the second electrode.

Light-emitting element and light-emitting device comprising the same

A light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor.

Light-emitting element and the manufacturing method thereof

A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting element has a top surface, a bottom surface, a side surface, and a first electrical contact formed on the bottom surface. The distance between the top surface and the bottom surface has a first height (h). The wavelength conversion layer has a first area (A) located on the top surface of the light-emitting element and a second area (A) located on the side surfaces and surrounding the first area. The first area has a second height (h). The second area has a third height (h) and a second width (w). The second height (h) is greater than the second width (w). The difference of the third height and the sum of the first height and the second height is less than 15 &#x3bc;m.

Light-emitting device with optimized viewing angle

An embodiment of present disclosure discloses a light-emitting device which includes a light-emitting unit, a transparent covering structure, a first reflective structure, a second reflective structure, and a wavelength conversion structure. The light-emitting unit includes a light-emitting surface, a bottom surface opposite to the light-emitting surface, a side surface, a first conductive electrode, and a second conductive electrode. The first conductive electrode and the second conductive electrode are located on the bottom surface. The transparent covering structure covers the light-emitting surface and the side surface. The first reflective structure surrounds the transparent covering structure. The second reflective structure is disposed under the first reflective structure and surrounds the first conductive electrode and the second conductive electrode. The wavelength conversion structure is disposed on the first reflective structure and the transparent covering structure.

Light-emitting device with wavelength conversion structure

Light-emitting device

Growing community of inventors

Hsinchu, Taiwan

Ching-Tai Cheng