Unimicron Technology Corporation

Other

Ching Sheng Chen

Shih-Lian Cheng

Pei-Wei Wang

Ra-Min Tain

Ming-Hao Wu

Chih-Chiang Lu

Jun-Rui Huang

Hsuan-Wei Chen

Shiau Hong-Rong

Hsin-Ning Liu

Zhe-Yong Lin

Li-Jie Liu

A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.

Circuit board having laminated build-up layers

A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

Package structure and manufacturing method thereof

A manufacturing method for a circuit board and a circuit board are provided. The method includes steps: providing a substrate having a first metal layer; forming a patterned first opening on the first metal layer to expose the substrate; forming a patterned first dielectric layer on the substrate, the first dielectric layer is made of a photosensitive dielectric material and covers the first opening; photosensitizing the first dielectric layer to cure the first dielectric layer; forming a patterned second metal layer on the first metal layer; forming a patterned third metal layer on the second metal layer, and the third metal layer being adjacent to the first dielectric layer; removing a portion of the first metal layer not covered by the second metal layer; and forming a second dielectric layer on the substrate. A thickness of the third metal layer is greater than a thickness of the second metal layer.

Manufacturing method for circuit board and circuit board thereof

An animal leash includes a length of aircraft cable and a clamp that can be adjusted along the cable. The clamp has an eye for receiving a snap connector on the end of the cable so that the leash can be formed with a loop with a fixed diameter. The leash permits the animal to move around a tree without the leash wrapping around the tree trunk.

Animal leash

A safety seat stand apparatus for coin-operated telephone sets includes: a stand body with a horizontal portion and a vertical portion having an open receiving chamber formed in the horizontal portion for securing a coin-operated telephone therein; a drawer-type coin box with a first lock device movably provided under horizontal portion in communication with the open receiving chamber; an information panel structure provided on the vertical portion of the stand body for posting various charges and information thereon; and a check member with a second lock device and a press piece closely engaged with the vertical portion of the stand body so as to safely secure the coin-operated telephone set in the open receiving chamber through the second lock device and the press piece; thereby, a coin-operated telephone set combined with the safety seat stand apparatus can be fixed on any solid supporting object for convenient usage.

Growing community of inventors

Taoyuan, Taiwan

Ching Sheng Chen