D-link Corporation

Ching-Rong Ko

Te-Wei Liu

A cooling fan mounting arrangement, which includes a fan rack fixedly fastened to the main board inside the housing of a network apparatus, and a fan supported on the fan rack, wherein the fan rack has a fan support frame obliquely raised from a flat mounting base frame thereof, and two angled suspension arms bilaterally raised from the fan support frame for holding the fan on the fan support frame, the suspension arms each having a retaining rod respectively engaged into a respective through hole at the fan to secure the fan in position.

Cooling fan mounting arrangement

A cooling fan mounting arrangement, which includes a network apparatus, the network apparatus having an upright side wall, one set of air vents at the upright side wall, and one pair of positioning means for example screw rods spaced from the upright side wall at a distance, and a cooling fan fastened to the screw rods and spaced from the upright side wall at a distance and aimed at the air vents at the upright side wall, the cooling fan has two mounting frames formed on the periphery thereof and outwardly diagonally extended in reversed directions at same elevation, the mounting frames each having a positioning means, for example, a through hole respectively coupled to the screw rods at the network apparatus and locked by a respective locking member, for example, a lock nut.

A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided above integrated circuits of the electronic product, with a layer of thermal conductive plate disposed therebetween. The heat generated by the integrated circuit elements during operation process is transferred to the cooling fins via the thermal conductive plate. Simultaneously, the cooling fan draws in air, which is discharged, via an air outlet thereof towards the cooling fins to dissipate the heat of the cooling fins. The cooling fan can be disposed directly above the heat sink body to enhance heat dissipation efficiency. A single cooling fan will suffice to achieve good heat dissipating effects, thus reducing manufacturing cost.

Growing community of inventors

Hsinchu, Taiwan

Ching-Rong Ko