Georgia Tech Research Corporation

Guangdong University of Technology

Other

Ching-Ping Wong

Yun Chen

Xin Chen

Jian Gao

Lejun Wang

Qiang Liu

Song-Hua Shi

Franklin Lambert

Dachuang Shi

Jun Li

Yang Rao

Haiying Li

Lianhua Fan

William P King

William Franklin Burgoyne, Jr

Jiali Wu

Samuel Graham, Jr

Junyu Long

Shenghui Zhang

Silvia Liong

Jianwen Xu

Daoqiang Lu

Kyoung-Sik Moon

Rongwei Zhang

Yixin Zheng

Huilong Liu

Shuang Zhou

Franklin Cook Lambert

Jun c/o Georgia Tech Research Corporation Li

A method for integrally forming a graphene film (GF) of a high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processing, includes: selecting a carbon precursor material, where the carbon precursor material is one selected from the group consisting of a biomass/hydrogel composite and a heavy hydrocarbon compound; adding an activator solution to an inside of the carbon precursor material to obtain a composite with an activator uniformly loaded, and spreading the composite on a flexible substrate to form a carbon precursor material layer; heating and drying the carbon precursor material layer; in-situ processing with an ultrafast UV laser to obtain an activated GF of a high SSA; and cleaning and drying the activated GF. With the method of the present disclosure, a microporous activated GF of a high SSA can be directly processed in-situ on a flexible substrate.

Method for integrally forming graphene film (GF) of high specific surface area (SSA) by ultrafast ultraviolet (UV) laser processing

A device for processing microstructure arrays of polystyrene-graphene nanocomposites, including a laser generator, a vacuum chamber, an object stage, an ultraviolet filter and a gas flow control unit. The object stage is detachably fixed to a bottom of the vacuum chamber with a passage that can be opened or closed. The ultraviolet filter is provided in the vacuum chamber. A laser light emitted by the laser generator arrives at the object stage through the ultraviolet filter. The object stage is configured to place a sample to be processed. The gas flow control unit is communicated with the vacuum chamber and is configured to control the flow of the gas entering the vacuum chamber. The vacuum chamber is fixed on a three-axis precision positioning platform via a vacuum chamber clamp. The device disclosed herein aims to solve the existing difficulty in processing microstructure arrays of polystyrene-graphene nanocomposites.

Method and device for processing microstructure arrays of polystyrene-graphene nanocomposites

A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.

Mass transfer method for micro-LEDs with a temperature-controlled adhesive layer

The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

Highly conductive electrically conductive adhesives

Methods of reducing pollution problems in power lines systems are disclosed herein. In one embodiment, the method comprises applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications. Further disclosed are methods of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability. Other aspects, features, and embodiments are also discussed and claimed.

Insulator coating for reducing power line system pollution problems

Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template onto the substrate. In some embodiments, the step of transferring the nanomaterials involves pressing the template onto the substrate such that the nanomaterials are embedded below a surface layer of the substrate. In some embodiments, the temperature of the plurality of nanomaterials is raised to assist the transfer of the nanomaterials to the substrate.

Systems and methods for nanomaterial transfer

The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.

Insulator coating and method for forming same

A poly(arylene ether) polymer includes polymer repeat units of the following structure:&#x2014;(O&#x2014;Ar&#x2014;O&#x2014;Ar)&#x2014;(O&#x2014;Ar&#x2014;O&#x2014;Ar)&#x2014;where Ar, Ar, Ar, and Arare identical or different aryl radicals, m is 0.05 to 0.95, n is 1-m, and at least one of the aryl radicals is grafted to at least one hydroxyalkyl group, such as 2-undecanol. The polymer is especially useful in electrically conductive adhesives.

Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives

Polymer composites and methods of making the polymer composites are presented. A representative polymer composite includes a polymer resin and a conductive material, wherein the polymer composite is characterized by a dielectric constant greater the 200. A representative method of making the polymer composite can be broadly summarized by the following steps: providing a polymer resin and a conductive material; mixing the polymer resin and the conductive material; and forming the polymer composite, wherein the polymer composite is characterized by a dielectric constant greater than 200.

High dielectric polymer composites and methods of preparation thereof

The present invention provides a novel process and its required fluxable materials for building low-cost flip-chip interconnect structures. The novel process involves two fluxable materials, fluxable wafer-level compressive-flow underfill material (WLCFU) and fluxable tacky film, and applies these two materials on a wafer level. The two materials can provide sufficient fluxing capability during solder reflow and significant improvement of the fatigue life of the formed solder interconnects after fully cured.

Process and material for low-cost flip-chip solder interconnect structures

Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane

A no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

No-flow reworkable epoxy underfills for flip-chip applications

The present invention is directed to polymer-ceramic composites having high dielectric constants formed using polymers containing a metal acetylacetonate (acacs) curing catalyst. In particular, it has been discovered that 5 weight percent Co(III) acac can increase the dielectric constant of DER661 epoxy by about 60%. The high dielectric polymers are combined with fillers, preferably ceramic fillers, to form two phase composites having high dielectric constants. Composites having about 30 to about 90% volume ceramic loading and a high dielectric base polymer, preferably epoxy, have been discovered to have a dielectric constants greater than about 60. Composites having dielectric constants greater than about 74 to about 150 are also disclosed. Also disclosed are embedded capacitors with capacitance densities of at least 25 nF/cm , preferably at least 35 nF/cm , most preferably 50 nF/cm . Methods to increase the dielectric constant of the two phase composites having high dielectric constants are also provided.

High dielectric constant nano-structure polymer-ceramic composite

A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

Thermally degradable epoxy underfills for flip-chip applications

A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.

Growing community of inventors

Berkeley Lake, GA, United States of America

Ching-Ping Wong