Intel Corporation

Ching-Ping Janet Shen

Ravi Shankar

Dilan Seneviratne

Charan K Gurumurthy

Liwen Jin

Deepak Arora

Aleksandar Aleksov

Chia-Pin Chiu

Yonggang Li

Anna M Prakash

Daniel N Sobieski

Shan Zhong

Charavana K Gurumurthy

Mark Saltas

Amanuel M Abebaw

Vinodhkumar Raghunathan

Olga Gorbounova

Rose Mulligan

Jean-Marie Erie

Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesive layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.

Compound parabolic concentrator including protrusion

Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.

Substrate or panel with releasable core

Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.

Flexible microelectronic systems and methods of fabricating the same

Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.

Panel with releasable core

Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.

Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.

Embedded architecture using resin coated copper

Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include (1) arranging a mask on a center portion of the panel, the panel including a center stiffener with a first foil attached to a first side of the center stiffener by a first adhesive layer and a second foil attached to a second side of the center stiffener by a second adhesive layer, the first side of the center stiffener opposite the second side of the center stiffener, (2) removing portions of exposed edges of the panel, and (3) removing the mask.

Growing community of inventors

Gilbert, AZ, United States of America

Ching-Ping Janet Shen