Industrial Technology Research Institute

Ching-Lin Lin

Meng-Chun Chen

Chen-Chung Du

Chia-Hung Huang

Chyi-Liou Lin

Do-Yu Lee

Jing-Ching Lin

A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.

Solder-ball supplying apparatus

A tape roll in-series package machine for neatly packing a plurality of tape rolls into a paper box. In includes (a) a conveying device, (b) an in-series filling device, and (c) a paper box elevating device. The in-series filling device contains first, second, and third pneumatic cylinder each of which is connected to a receiving plate to cooperatively pack a row of the tape rolls into a paper box. The paper elevating device contains (i) a paper box conveyor which is divided into front section, middle and rear sections, each of the sections is driven by a separate mechanism; (ii) an elevating frame disposed above the middle section of the paper box conveyor, wherein the elevating frame contains a pair of fending plates each being driven by a revolving pneumatic cylinder for holding the paper box in place and facilitating the incoming and outgoing motions of the paper box; and (iii) a Z-axis stepping motor which is provided to control an up-and-down motion of the elevating frame so as to adjust a vertical position of the paper box.

Tape roll in-series package machine

Growing community of inventors

Hsinchu, Taiwan

Ching-Lin Lin