Coretech System Co., Ltd.

Ching-Kai Chou

Rong-Yeu Chang

Chia-Hsiang Hsu

Chih-Chung Hsu

Li-Hsuan Shen

Chien-Ting Wu

Wei-Yu Lin

Chia-Peng Sun

Hsun Yang

Kai-Yi Bai

The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.

Method of mesh generation for resin transfer molding process

The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.

Method of measuring voids in underfill package

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Zhubei, Taiwan

Ching-Kai Chou