Hewlett-Packard Company

Ching K Chieng

Charles L Thierheimer, Jr

Frank L Cloutier

Siow W Min

A fabrication method for applying electrically conductive circuit traces to a substrate is described. The method uses an ink composition which is applied to a selected substrate by an ink delivery system. The ink includes an adhesive in combination with other additives, including one or more sovlents. The ink is delivered by the ink jet system in a selected pattern, followed by the application of a powdered metal to the pattern which adheres to the adhesive in the ink. After the removal of excess powder, the substrate, pattern and powder are heated in an amount sufficient to melt the powder on the substrate. This produces a pattern of conductive traces geometrically corresponding to the ink pattern initially applied to the substrate.

Method for applying a conductive trace pattern to a substrate

New inks for thermal ink-jet printers are formulated by replacing all or a large percentage of the aqueous component in prior art inks with an organic liquid which can adhere to, dissolve, swell, or penetrate a plastic film and also act as a solvent for the dyestuff in the ink. Present in the inks is a small percentage of a jetting agent. With these inks, a wide variety of plastic films can be marked with an ink-jet printer. The printed ink is water-fast, smear resistant, and substantially indelible.

Growing community of inventors

Singapore, Singapore

Ching K Chieng