Unity Opto Technology Co., Ltd.

Other

Tsinghua University

Ching-Huei Wu

Chih-Hsien Wu

Wei-Chung Lin

Wei Chang

Huan-Ying Lu

Ping-Chen Wu

Yung-Ching Hu

Cheng-Chien Ou

Kai-Cheng Chuang

Yen-Yin Lin

Sen-Yuh Tsai

An-Chung Chiang

Shih-Chao Shen

Chih-Chao Chang

Yuan-Yao Lin

Ching-Li Chou

Chun-Chi Chou

Shih-Hsun Chang

Ming-Shiun Wu

Ying-Ju Chen

Shi-Wei Zhu

Mang-Shiang Lee

An LED lighting module with micro led arrays and phosphor film is disclosed. The LED lighting module includes a plurality of micro LED arrays and a phosphor film. The micro LED arrays are respectively composed of at least one micro LED. The phosphor film is disposed on one side of the micro LED arrays; and the phosphor film has a transparent substrate and is provided with a plurality of light emitting regions. The plurality of light emitting regions are arranged adjacent to each other and into a matrix form, and are set corresponding to the micro LED arrays collimation respectively. A part or the whole of the surface of the plurality of light emitting regions is provided with at least one type of phosphor powder.

LED lighting module with micro LED arrays and phosphor film

An LED lighting module and a display having the LED module are disclosed. The LED lighting module includes a plurality of micro LED arrays and a phosphor film. The micro LED arrays are respectively composed of at least one micro LED. The phosphor film is disposed on one side of the micro LED arrays; and the phosphor film has a transparent substrate and is provided with a plurality of light emitting regions. The plurality of light emitting regions are arranged adjacent to each other and into a matrix form, and are set corresponding to the micro LED arrays collimation respectively. A part or the whole of the surface of the plurality of light emitting regions is provided with at least one type of phosphor powder.

Display having a LED lighting module

A method for manufacturing micro LED panel and micro LED panel thereof is disclosed. The method includes defining a plurality of pixel regions on an optical element carrier; providing a first solder portion, or a first solder portion, a second solder portion and a third solder portion in each pixel region; selecting a plurality of process substrates and defining a process area on each process substrate; setting a first process mode, a second process mode and a third process mode, and determining the number of process substrates in the first process mode, the second process mode and the third process mode according to the number of units; then the process area of the process substrate will form a plurality of first micro light emitting chips corresponding to the position of the first soldering portion.

Method for manufacturing micro LED panel and micro LED panel thereof

Disclosed are an LED light emitting device and its manufacturing method. A blue LED chip specification is selected, a green phosphor and the blue LED chip are used to determine a green light frame on the CIE1931 chromaticity coordinates and a red phosphor together with a blue LED chip are used to determine a red light frame on the CIE1931 chromaticity coordinates, and a predetermined straight line passing through the color temperature target frame is selected, and both end points of the predetermined straight line fall within the green light frame and the red light frame, so as to determine the concentration of the green phosphor and the red phosphor, and the green and red phosphors and a blue LED chip are packaged to form a first LED and a second LED, and at least one first LED and at least one second LED are installed on a substrate.

Manufacturing method of LED light emitting device

An LED bracket includes a first metal sheet, a second metal sheet and a casing. The casing covers the first and second metal sheets and includes a receiving slot. The casing partially covers the first and second metal sheets. The first metal sheet has a first pin terminal and a first carrying end. The second metal sheet has a second pin terminal and a second carrying end. The non-bent first and second pin terminals are opposite to each other and extended outwardly from the casing. The first and second carrying ends are disposed in the receiving slot and respectively have at least one first support portion and at least one second support portion to enhance the strength of fixing the first and second metal sheets with the casing. The non-bent pins improve the degree of freedom of the design of the casing and the light emission efficiency of LEDs.

Light emitting diode bracket

LED package

An automatically controlled directional speaker includes a sound amplifying device, an image capture device, a computing device, an azimuth control motor and an amplitude control unit. The image capture device is provided for detecting the status of surrounding environment to generate image information, and the computing device is communicatively coupled to the image capture device for determining whether there is at least one face information in the image information, and the azimuth control motor is coupled to the sound amplifying device for controlling the azimuth of an output sound of the sound amplifying device according to the face information, and the amplitude control unit is communicatively coupled to the sound amplifying device for controlling the volume of the output sound of the sound amplifying device according to the face information. The speaker may be combined with a lamp to form an LED lamp with broadcasting and illumination functions.

Automatically controlled directional speaker, and lamp thereof

Disclosed is a single-chip twin light source light emitting device including a first epitaxial layer, a substrate, and a second epitaxial layer. The first epitaxial layer includes a first n-type semiconductor layer with a n-type conducting structure, a first light emitting layer with a multi-quantum well structure, and a first p-type semiconductor layer with a p-type conducting structure. The second epitaxial layer includes a second n-type semiconductor layer with a n-type conducting structure, a second light emitting layer with a multi-quantum well structure, and a second p-type semiconductor layer with a p-type conducting structure. Therefore, the light emitting device can emit one-color or two-color light by controlling the first epitaxial layer and the second epitaxial layer respectively.

Single-chip twin light source light emitting device

Foldable desk lamp

Disclosed is a white light emitting diode module including a conducting wire frame, a first primary color chip, a second primary color chip and a phosphor layer. The conducting wire frame has an accommodating groove. The first primary color chip is installed at the bottom of the middle of the accommodating groove, and the first primary color chip transmits a first light emitting source with a wavelength &#x3bb;. The second primary color chip is stacked on top of the first primary color chip and the second primary color chip transmits a second light emitting source with a wavelength &#x3bb;. The phosphor layer is formed on the second primary color chip and excited to produce a fluorescent light with a wavelength &#x3bb;. Therefore, the stacked LED chips and the phosphor can be used to obtain a white light source with high color saturation.

White light emitting diode module

Disclosed is an all-angle light emitting element having high heat dissipating efficiency. The all-angle light emitting element has a transparent substrate, at least one light emitting chip, at least one heat dissipating rib and thermal glue. The transparent substrate has a chip fixing area with an area A. The heat dissipating rib is attached onto the transparent substrate, and the heat dissipating rib has a heat dissipating section and a heat source contact section, and the heat source contact section has an area B, and 3%&#x2266;B/A&#x2266;26%. The heat dissipating section and the heat source contact section of the heat dissipating rib can effectively conduct the heat generated by an optical chip and provide a 360-degree all-angle light emission.

All-angle light emitting element having high heat dissipating efficiency

A laser-optical position detecting module with a laser as a light source is disclosed, which includes a laser mode conversing assembly, having a laser source capable of emitting a time-modulated laser beam; a laser mode conversing unit, used to expand the time-modulated laser beam to a two-dimension sensing plane; a drive control unit, adopted for driving the laser source to emit the time-modulated laser beam; and a detector matrix. The laser mode conversing unit has a phase delay device and a passive optical device capable of reflecting the light; so that, through the laser mode conversing unit, the laser-optical position detecting module can expand the light emitted by the laser source to the two-dimension sensing plane without using any other mechanical scanning.

Laser-optical position detecting module

An adjustable lighting device having a main body, a light generation device inserted into a receptacle, a movable lens, a base electrically connected to the light generation device, and an adjustor cover rotatably mounted to and covering the outside of the main body so that rotation of the adjustor cover causes the lens to extend/retract within the receptacle so that the extension/retraction of the lens can be controlled by the rotation of the adjustor cover for realizing focus adjustment.

Adjustable lighting device

An optic control module includes a housing, a light source, an optic lens body, a detector, and a control circuit. The housing contains therein a circuit board in electrical connection with a plurality of terminal pins. The light source is mounted on the circuit board and is electrical connection with the terminal pins for providing light. The light, after transmitting, in sequence, through a first optic curved surface, a first inclined surface, and a second optic curved surface of the optic lens body, leave the optic lens body and is then reflected by an operative body located above the optic lens body to travel through a third recess and a third optic curved surface of the optic lens body to get back to the detector. The detector is arranged on the circuit board of the housing at a location below a second protrusion of the optic lens body to receive and process the reflected light. The control circuit is formed on the circuit board to receive a signal transmitted from the detector to control the operation of the optic control module. As such, a modularized optic control module is provided.

Growing community of inventors

Taipei, Taiwan

Ching-Huei Wu