National Chung Hsing University

Chang Chun Plastics Co., Ltd.

Chung-shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense

National Chung Shan Institute of Science and Technology

Cpc Corporation, Taiwan

Swancor Innovation & Incubation Co., Ltd.

Ching-Hsuan Lin

Kuen-Yuan Hwang

An-Pang Tu

Wen-Chiung Su

Tsung Li Lin

Fang-Hsien Su

Yu-Ting Fang

Hung-Tse Lin

Chia-Wei Chang

Wen-Chang Chen

Shenghong A Dai

Ru-Jong Jeng

Jann-Chen Lin

Ming-Yu Huang

Yih-ping Wang

Sheng-De Li

Jui-Fu Kao

Ya-Ru Taso

Hao-Hsin Lee

Chun-Ku Liu

Han-Ya Lin

Way-Chih Hsu

Wei-Yen Chen

Tsung-Li Lin

Yu-Hsiang Lin

Yi-Chun Chen

Meng-Wei Wang

Jhao-Wei Sie

Chau-Wei Hsieh

Wei-Feng Hsiao

Yu-Wei Chou

Cheng-Liang Liu

Sheng-Chen Liao

Jun-Cheng Ye

Po-Chun Yang

Yu-Wei Tian

You-Lin Shih

Yu An Lin

Yi-Ning Chiang

Yu-Ming Hu

Yi-Hsuan Hsieh

Sheng Lung Chang

Feng-Jen Wang

Ren-Yu Yeh

Chia Wei Chang

Wan-Ling Hsiao

Po-Wen Cheng

Yu Ming Hu

Zi-Jun Chen

Hong Tze Lin

A carbonate-containing epoxy resin and a manufacturing method for a carbonate-containing epoxy resin, an epoxy cured product and a method for degrading an epoxy cured product are provided. The carbonate-containing epoxy resin includes a structure represented by formula (I) or formula (II). Formula (I) and formula (II) are defined as in the specification.

Carbonate-containing epoxy resin, manufacturing method thereof, epoxy curable product prepared thereby and method for degrading epoxy curable product

The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.

Loss-dissipation flexible copper clad laminate, manufacturing method thereof, and electronic device

An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent &#x2014;NR&#x2014;, &#x2014;CO&#x2014;, &#x2014;SO&#x2014;, &#x2014;CS&#x2014;, &#x2014;SO&#x2014;, &#x2014;CH&#x2014;, &#x2014;O&#x2014;, null, &#x2014;C(CH)&#x2014;, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.

Oligomer (2,6-dimethylphenylene ether) together with fabrication method and cured product thereof

A phosphinated (2,6-dimethylphenyl ether) oligomer, preparation method thereof and cured product. The phosphinated (2,6-dimethylphenyl ether) oligomer includes a structure represented by Formula (1): wherein X is a single bond, &#x2014;CH&#x2014;, &#x2014;O&#x2014;, &#x2014;C(CH)&#x2014; or R', R, R, Rand Rare independently hydrogen, C1-C6 alkyl or phenyl; n and m are independently an integer from 0 to 300; p and q are independently an integer from 1 to 4; Y is hydrogen, U and V are independently an aliphatic structure.

Phosphinated (2,6-dimethylphenyl ether) oligomer, preparation method thereof and cured product

The present disclosure provides a phosphorus-containing compound, which includes a structure represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a flame-retardant thermoset made by the phosphorus-containing compound including the structure represented by formula (I). The present disclosure also provides a manufacturing method for the phosphorus-containing compound.

Phosphorus-containing compound, manufacturing method thereof and flame-retardant thermoset

A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.

DCPD-derived polyether and method of producing the same

A polymeric benzoxazine resin structure with an adamantane-containing main chain produces materials of low dielectric characteristics when cured.

Polymeric benzoxazine resin structure with adamantane-containing main chain

A series of novel phosphorus-containing compounds having the following formula is provided:  A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.

Phosphorous-containing compounds and their preparation process and use

A copolymer of DCPD-containing benzoxazine (DCPDBz) and cyanate ester resin forms a low-dielectric thermosetting polymeric material for making electronic components. A method of manufacturing the copolymer is also introduced. The method includes allowing DCPD-phenol oligomer, aniline, and paraformaldehyde to react at 110&#xb0; C. for 6-12 hours before being extracted and baked to obtain DCPDBz; and mixing cyanate ester and the DCPDBz at 150&#xb0; C.; heating the mixture up to 220&#xb0; C.

Copolymer of DCPD-containing benzoxazine (DCPDBz) and cyanate ester resin, and method of manufacturing the copolymer

A series of novel phosphorus-containing compounds having the formula: is provided in which R-R, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof, as well as a polymer of formula (PI), and preparation process and use thereof are also provided.

Phosphorus-containing compounds and their preparation process and use

The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof: 

Monofunctional, bifunctional, and multifunctional phosphinated phenols and their derivatives and preparation method thereof

A series of curing agents are provided. The curing agents are multi-functional and phosphorus-containing. The curing agents have excellent processability to be used as an epoxy resin curing agent. The curing agents can be cured to obtain a phosphorus-containing epoxy thermoset with flame retardancy characteristic. The epoxy thermosets are very fit for circuit board substrate having high glass transition temperature; semiconductor packaging material; and related materials.

Processes of synthesizing multi-functional phosphorus-containing epoxy curing agent

Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.

Phosphorus-containing benzoxazine-based bisphenols, derivatives thereof, and preparing method for the same

Disclosed is a method for making a low-k, flame-retardant, bi-functional benzoxazine. The method includes the steps of dissolving phosphoric diamine with various functional groups, phenolic adamantane and paraformaldehyde in a solvent at 72&#xb0; C. to 88&#xb0; C. for 7 to 9 hours, and cooling and introducing the solution in n-hexane to separate the low-k, flame-retardant, phosphoric, bi-functional benzoxazine.

Low-k, flame-retardant, bi-functional benzoxazine and method for making the same

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Taichung, Taiwan

Ching-Hsuan Lin