Polytronics Technology Corporation

Ching Han Yu

Pao Hsuan Chen

David Shau Chew Wang

Tong Cheng Tsai

Zack Lin

Yun Ching Ma

An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.

Over-current and over-voltage protection assembly apparatus

The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.

Protective circuit board and overcurrent protection device thereof

An over-current protection device comprises at least one PTC component, at least one thermal dissipation layer, at least one adhesive layer and at least two isolation layers, wherein the PTC component is formed by interposing a PTC material between two electrode layers. The at least one adhesive layer as a thermal conductive medium is interposed between the PTC component and at least one thermal dissipation layer to combine them. The at least two isolation layers separate the thermal dissipation layer, adhesive layer and electrode layers into two electrical independent portions.

Over-current protection device and manufacturing method thereof

An over-current protection apparatus comprises a plurality of over-current protection devices and a bonding sheet. Each over-current protection device comprises at least one current-sensitive element, two outer electrode layers and at least one insulating layer disposed on a surface of the current-sensitive element. The bonding sheet penetrates and connects the plurality of over-current protection devices, and is disposed on a surface of the at least one current-sensitive element for insulation.

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Hualien, Taiwan

Ching Han Yu