Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Flybikes S.l.

Ching-Chung Hsu

Chung-Long Chang

Cheng-Yuan Tsai

Cheng-Chieh Hsieh

Tsung-Yu Yang

Chen-Fa Lu

Hung-Chi Li

Che-Yung Lin

Grace Chang

Chun-Hung Chen

Chih-Ping Chao

Kuan-Chi Tsai

Wei-Kung Tsai

Yi-Sin Wang

Shao-Yu Chen

Hsiang-Chi Chen

Cheng-Chang Hsu

The present disclosure provides a method for manufacturing a semiconductor structure, including patterning a photo-sensitive polymer layer with a plurality of trenches by a first mask, the first mask having a first line pitch, patterning a photoresist positioning on a mesa between adjacent trenches by a second mask, the second mask having a second line pitch, the first mask and the second mask having substantially identical pattern topography, and the second line pitch being greater than the first line pitch, and selectively plating conductive material in the plurality of trenches.

Semiconductor structure with ultra thick metal and manufacturing method thereof

A device includes a dielectric layer, an interlayer metal pad in the dielectric layer, a first capacitor over the interlayer metal pad, and a second capacitor over the dielectric layer. The first capacitor includes a first bottom capacitor electrode over and in contact with the interlayer metal pad, a first top capacitor electrode, and a first inter-electrode dielectric layer between the first bottom capacitor electrode and the first top capacitor electrode. The second capacitor includes a second bottom capacitor electrode over and in contact with the dielectric layer, a second top capacitor electrode, and a second inter-electrode dielectric layer between the second bottom capacitor electrode and the second top capacitor electrode.

Integrated circuit

The present disclosure provides a semiconductor structure having an ultra thick metal (UTM). The semiconductor structure includes a substrate, a metal layer over the substrate, and an UTM over the metal layer. An area density of the UTM is greater than 40% and a thickness of the UTM is equal to or greater than 6 micrometer. The present disclosure provides a method for manufacturing a semiconductor structure having a UTM. The method includes patterning a dielectric layer with a plurality of trenches by a first mask, patterning a photoresist positioning on a mesa between adjacent trenches by a second mask, and selectively plating conductive materials in the plurality of trenches.

A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.

Multi-terminal inductor for integrated circuit

An integrated circuit includes a stacked MIM capacitor and a thin film resistor and methods of fabricating the same are disclosed. A capacitor bottom metal in one capacitor of the stacked MIM capacitor and the thin film resistor are substantially at the same layer of the integrated circuit, and the capacitor bottom metal and the thin film resistor are also made of substantially the same materials. The integrated circuit with both of a stacked MIM capacitor and a thin film resistor can be made in a cost benefit way accordingly, so as to overcome disadvantages mentioned above.

Integrated circuit and manufacturing method thereof

A detachable accessory carrier for bicycle includes a fixed seat, a positioning member and a fastener. The fixed seat has a positioning portion and a fixing portion communicated mutually. The positioning member has an inserting portion that includes a propping portion corresponding to the fixing portion so that when the inserting portion of the positioning member is assembled to the positioning portion of the fixed seat, the fastener can be coupled with the fixing portion and abut against the propping portion of the positioning member, thereby attaching the detachable accessory carrier reliably to the frame tube of the bicycle. The detachable accessory carrier can be partially detached with only the fixed seat left on the frame tube of the bicycle. The fixed seat has a rim conforming to a periphery of the frame tube so it will not interfere with the cyclist's riding or scrape the cyclist's skin.

Detachable accessory carrier for bicycle

A pitch adjusting mechanism for a bicycle saddle is arranged between a saddle and a seat post of the bicycle and includes: a base beneath the saddle; a connecting member being fixed to the seat post; a washer being removably assembled to a top or a bottom of the connecting member; and a fastener combining the connecting member, the washer and the base as a whole. When the washer is arranged on the top and beneath the bottom of the connecting member, a pitch of the saddle with respect to the seat post is different.

Growing community of inventors

Taichung, Taiwan

Ching-Chung Hsu