Mediatek Corporation

Ching-Chih Li

Nan-Cheng Chen

Sheng-Ming Chang

Chun-Wei Chang

Che-Yuan Jao

Nan-Jang Chen

Yang Liu

Ying Liu

Shih-Chieh Lin

Chih-Hui Kuo

Jui-Hsing Tseng

Chun-Neng Liao

Hui-Chi Tang

Fu-Kang Pan

Chee-Kong Ung

PoHao Chang

Pei-San Chen

Meng-Hsin Chiang

Pohao Chang

The present invention provides a device for testing a chip, wherein the device includes a testing board and an interposer. The testing board has a plurality of pads for providing a plurality of test signals. The interposer board includes a plurality of passive components, and at least one of the passive components is coupled between a supply voltage and a ground voltage, and the supply voltage and the ground voltage are received from a power pad and a ground pad of the plurality of pads of the testing board, respectively; wherein the chip is positioned in the device, the chip receives the test signals including the supply voltage and the ground voltage from the power pad and the ground pad of the testing board, respectively.

Device for testing chip or die with better system IR drop

A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.

Semiconductor integrated circuit device

An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins, and a plurality of driving units coupled to the pins. The control circuitry provides a plurality of control signals according to data to be transmitted. The pins are coupled to a device via a plurality of conductive traces of a printed circuit board (PCB). The control signals control each of the driving units to selectively provide the data or one specific shielding pattern via the corresponding pin and the corresponding conductive trace of PCB to the device.

Integrated circuit, electronic device and method for transmitting data in electronic device

A layout method for a printed circuit board (PCB) is provided. The method obtains a memory type of a dynamic random access memory (DRAM) to be mounted on the PCB, obtains a module group from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules, obtains a plurality of PCB parameters, selects a specific routing module from the module group according to the PCB parameters, and implements the specific routing module into a layout design for PCB fabrication. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

Layout method for printed circuit board

A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.

Leadframe package for high-speed data rate applications

An electronic package is provided. The electronic package comprises a die pad having a die attached thereon. A plurality of leads surrounds the die pad and spaced therefrom to define a ring gap therebetween. At least one first common electrode bar is in the ring gap and substantially coplanar to the die pad, in which at least one of the plurality of leads extends to the first common electrode bar. A molding compound partially encapsulates the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed. A length of the first common electrode bar is substantially equal to a predetermined distance between two pads among a plurality of power or ground pads on a side of the die facing the first common electrode bar. An electronic device with the electronic package is also disclosed.

Quad flat package with exposed common electrode bars

The present invention provides a semiconductor device capable of eliminating voltage (IR) drop of a semiconductor die inside the semiconductor device and a fabricating method of the semiconductor device. The semiconductor device comprises the semiconductor die, and the semiconductor die comprises a first surface area, a plurality of first pads potentially equivalent to each other, a passivation layer, a plurality of first openings, and a first conducting medium layer. The passivation layer is disposed on the plurality of first pads. The plurality of first openings is formed on the passivation layer, and utilized for exposing the plurality of first pads. The first conducting medium layer is formed on the first surface area, and utilized for fulfilling the plurality of first openings to connect the plurality of first pads.

Semiconductor device and fabricating method thereof

A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces are formed in a level of the metal interconnection; a passivation layer disposed over the two metal traces, wherein two openings are formed in the passivation layer to expose portions of the two metal traces; a conductive member externally mounted on the passivation layer between the two openings; and a redistribution layer formed over the conductive member.

Semiconductor chip having conductive member for reducing localized voltage drop

The layout circuit comprises a first 3&#xd7;2 grid array and a second 3&#xd7;2 grid array. The first 3&#xd7;2 grid array comprises first, second and third signal contact points and the first and second fixed potential contact points are coupled to a first fixed potential. The first and second fixed potential contact points are arranged diagonally into the first 2&#xd7;2 array and the first and second signal contact points are also arranged diagonally into the first 2&#xd7;2 array. The second 3&#xd7;2 grid array comprises fourth, fifth and sixth signal contact points and the third and fourth fixed potential contact points are coupled to the first fixed potential. The third and fourth fixed potential contact points are arranged diagonally into the second 2&#xd7;2 array and the fourth and fifth signal contact points are also arranged diagonally into the second 2&#xd7;2 array.

Layout circuit

Memory controllers and methods of optimizing pad sequences thereof are provided. At least two different preferred trace sequences on printed circuit boards for at least one memory device are first provided. One memory controller is then provided to have a core logic circuit, a plurality of input/output (I/O) devices, and a reorderer. The core logic has I/O terminals. Each I/O device on the single chip has a pad. The reorderer is coupled between the core logic circuit and the input/output devices, programmable to selectively connect the input/output devices to the input/output terminals. The reorderer is later programmed to select and connect a portion of the input/output devices to the input/output terminals such that one of the different preferred trace sequences is substantially supported.

Memory controllers and pad sequence control methods thereof

A memory system includes a first memory unit, a transmission bus having an impedance, and a memory controller having a first on-die termination circuit, coupled to the first memory unit through the transmission bus. The first on-die termination circuit matches the impedance of the transmission bus in response to the memory controller writing data to the first memory unit.

Growing community of inventors

Taipei County, Taiwan

Ching-Chih Li