Delta Electronics, Inc.

Ching-Chi Yang

Kai-Ti Chang

Hsueh-Kuo Liao

Hsien-Chung Lee

Tzu-Sen Hung

Chuna-Jia Cheng

Sheng-Chih Tsai

A parallel module driver is disclosed and includes a modular backplane structure, a rectifier module and an inverter module. The modular backplane structure includes a plurality of connectors arranged equidistantly in a first direction. The rectifier module includes a rectifier-connection slot connected to one of the plurality of connectors in a second direction. The inverter module includes an inverter-connection slot connected to one of the plurality of connectors in the second direction. The rectifier module and the inverter module are arranged adjacent to each other, the rectifier-connection slot and the inverter-connection slot are connected to two adjacent connectors on the modular backplane structure, respectively. The lateral sides of the rectifier module and the inverter module are attached to each other, and respectively include a guiding element and a guiding groove matched with each other and limiting the rectifier module and the inverter module to slide in the second direction.

Parallel module driver

A package structure of a power module includes an insulation frame, a first circuit substrate, an insulation cover, plural first pins, plural posts and a fastening element. The insulation frame includes a sidewall and a first coupling part. The first coupling part is externally protruded from the sidewall. The first coupling part includes a first mounting structure. The first circuit substrate is combined with a bottom part of the insulation frame. The insulation cover is combined with a top part of the insulation frame. The insulation cover includes a second coupling part. The second coupling part includes a second mounting structure. The plural posts are embedded in the at least one first coupling part of the insulation frame, and partially penetrated through the second coupling part. The fastening element is connected with the first mounting structure and the second mounting structure.

Package structure of power module

Growing community of inventors

Taoyuan, Taiwan

Ching-Chi Yang