Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Furui Precise Component (kunshan) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

Ching-Bai Hwang

Jui-Wen Hung

Jie Zhang

Zhi-Hui Zhao

Ran Lin

Jin-Gong Meng

Chih-Hao Yang

Nien-Tien Cheng

Yung-Fa Cheng

Rung-An Chen

Po-Hsuan Kuo

Wen-Jie Zhang

Cheng-Jen Liang

Chih-Hung Chang

Li-Fu Xu

Hung-Chou Chan

Chih-Yuan Lin

Yeu-Lih Lin

Wei-Jen Huang

Yi-Chyng Fang

Chih-Hsun Lin

Shu-Cheng Yang

Jian-Zhong Lu

Hung-Nien Chiu

Jr-Shiun Chen

Shih-Yao Li

Hui-Feng Wu

Pei-Pin Pai

Jie-Bo Peng

Zhi-Jian Li

A heat dissipating system for a data center includes a return air area and an installation area. The return air area defines a return air damper and an air outlet, and the installation area defines an air inlet damper and an air outlet damper. The installation area includes a fan control unit, a humidity control unit and an electronic device. When the humidity control unit detects that the humidity value in the installation area is greater than a standard value, the humidity control unit controls the return air damper to partly open. Warmed air generated by the electronic device partly flows to the return air area through the return air damper, and the cold air and the warmed air are mixed. The mixed air is configured to dissipate heat for the electronic device, and the humidity in the data center is reduced.

Heat dissipating system for data center

A container data center includes a container, a number of air filtering modules, a number of cabinets received in the container, a heat dissipation apparatus, and a controller apparatus. The container includes a first sidewall defining a number of air inlets and a second sidewall defining a number of air outlets. A number of shielding plates are rotatably connected to the second sidewall to cover the air outlets. The air filtering modules are mounted to the first sidewall aligning with the air inlets. Each air filtering module defines a through hole communicating with the corresponding air inlet. Each air filtering module includes a number of fans and a number of rotating plates rotatably connected to cover the through hole. The controller apparatus includes a first motor driving the shielding plates, a second motor driving the rotating plates, a temperature sensor, a switch controlling the heat dissipation apparatus.

Container data center

A container data center includes a container, a number of server cabinets received in the container, a heat dissipation apparatus, a ventilation pipe, and a control device. The container defines a number of air inlets and a number of air outlets. A number of first shielding plates movably coupled to the container to cover the air inlets and a number of second shielding plates movably coupled to the container to cover the air outlets. The container forms a cooling air channel at one side of the server cabinets and a heat air channel at an opposite side of the server cabinets. The ventilation pipe is communicated between the heat dissipation apparatus and at least one of the air inlets, the ventilation pipe defines a opening communicating with the heating air channel, and a third shielding plate is movably coupled to the ventilation pipe to cover the corresponding through hole.

An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Electronic deviec having heat dissipation device

An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

Electronic device having heat dissipation device

An LED lamp includes a heat sink, a heat pipe and an LED. The heat sink includes a connecting core and fins mounted around the connecting core. Each of the fins includes a plate-shaped main body and a flange extending perpendicularly from a periphery side of the main body. The flanges of the fins cooperatively form an annular planar top surface of the heat sink. The heat pipe includes a condensing section, an evaporating section parallel to and higher than the condensing section and an adiabatic section connected between the condensing section and the evaporating section. The condensing section is fixed to and thermally connects with the top surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface thereof facing outwardly.

LED lamp

A lamp includes a heat sink and a lamp cover mounted on the heat sink. The lamp cover includes a connecting portion. The heat sink includes a plurality of clamping portions. The plurality of clamping portions surrounds the lamp cover and is spaced apart from each other along a circumferential direction. The plurality of clamping portions each defines a recess facing the lamp cover. The recesses communicate with each other along the circumferential direction whereby an annular engaging groove is defined in the heat sink by the recesses. The connecting portion is engaged in the engaging groove whereby the lamp cover is connected with the heat sink.

Lamp with heat sink and lamp cover mounted on the heat sink

A thermal module assembly includes a first thermal module () and a second thermal module (). The first thermal module () has a fan () with an air outlet, a first heat sink () positioned at the air outlet and a first clamp portion () formed on the first heat sink (). The second thermal module () has a second heat sink () and a second clamp portion () formed on the second heat sink (). The second heat sink () is juxtaposed with the first heat sink (). The first heat sink () and the second heat sink () are combined together via engagement of the first clamp portion () and the second clamp portion () so that airflow produced by the fan () flows past the first heat sink () and the second heat sink () in order.

Thermal module assembly and heat sink assembly having at least two engageable heat sinks

A cooling fan includes a housing, a cover on the housing and an impeller received in a space between the housing and the cover. The housing includes a bottom wall and a sidewall projecting upwardly from an outer periphery of the bottom wall. The sidewall defines an air outlet therein. The impeller includes a hub and a plurality of blades extending radially out from the hub. A porous layer extends into the space between the housing and the cover from the sidewall at a location adjacent to the air outlet.

Cooling fan

A centrifugal fan includes a fan frame (), and a stator () and a rotor () received in the fan frame. The fan frame includes a bottom base (), an opposite top cover () and a side wall () interconnecting the bottom base and the top cover. A first air inlet () is defined in the top cover and a second air inlet () is defined in the bottom base. The rotor includes a hub () and a plurality of blades () extending from an outer periphery of the hub. An air flow channel () is formed between an outer periphery of the blades and the side wall of the fan frame. A cylindrical wall () is formed around one of the first air inlet and the second air inlet to guide airflow from the first and second air inlets into the air flow channel and block the airflow in the air flow channel from flowing back towards the first and second air inlets.

Centrifugal fan

An exemplary heat sink includes elongated fins stacked together. Each of the fins includes a first dissipating portion and a second dissipating portion arranged in turn along a longitudinal axis of the fin. The first dissipating portion and the second dissipating portion of each fin are offset from each other along a stacked axis of the fins. An opening is defined in each fin between the first dissipating portion and the second dissipating portion thereof.

Heat sink providing redistributed airflow therethrough

A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source.

Heat dissipation module and electronic device having the same

A centrifugal fan includes a top cover plate, a bottom plate, a sidewall and an impeller. The sidewall is defined with an air outlet. The impeller includes a hub and a plurality of blades extending radially outwardly from the hub. An air passage channel is defined between outmost free ends of the blades and an inner surface of the sidewall. A tongue is provided near the air outlet and protrudes inwardly and laterally from the inner surface of the sidewall towards the outmost free ends of the blades. The tongue has an outer surface facing the outmost free ends of the blades. A plurality of grooves is defined in the outer surface along a lengthwise direction of the tongue.

An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm.

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Taipei Hsien, Taiwan

Ching-Bai Hwang