Au Optronics Corporation

Chin-Yuan Ho

Tsung-Tien Wu

Yi-Cheng Liu

Chen-Chi Lin

Kuo-Lung Lo

Chu-Yu Liu

Yi-Fen Lan

Tsung-Yi Lin

Hui-Yang Chuang

A light-emitting device, including a circuit substrate, a first light-emitting diode, and a first fixing structure, is provided. The circuit substrate includes a substrate, a first pad, a flat layer, and a first electrical connection material. The first pad and the flat layer are located on the substrate. The flat layer has a first opening overlapping the first pad. The first electrical connection material is located in the first opening and is electrically connected to the first pad. The first light-emitting diode is located on the flat layer and in contact with the first electrical connection material. The first fixing structure is located between the first light-emitting diode and the flat layer. The vertical projection of the first fixing structure on the substrate is located in the vertical projection of the first light-emitting diode on the substrate.

Light-emitting device

A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.

Light-emitting apparatus including sacrificial pattern and manufacturing method thereof

A light emitting device includes a substrate, an adhesion layer, a micro light emitting device (&#x3bc;LED), a first conductive layer, and a second conductive layer. A light emitting surface of the &#x3bc;LED is away from the substrate. The &#x3bc;LED includes a first semiconductive layer, a second semiconductive layer, a tether layer, a first electrode, and a second electrode. The tether layer covers a portion of sidewalls of the first semi-conductive layer, a portion of a bottom surface of the first semi-conductive layer, sidewalls of the second semiconductive layer, and a portion of a bottom surface of the second semiconductive layer. The first electrode and the second electrode are respectively electrically connected to the first semiconductive layer and the second semiconductive layer. The first conductive layer and the second conductive layer are respectively electrically connected to the first electrode and the second electrode.

Light emitting device and manufacturing method thereof

A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

Display panel

Display panel and method for forming micro component support

A display device includes a substrate, a first light emitting element, and a second light emitting element. The substrate includes at least one pixel area. The first light emitting element and the second emitting element are disposed in the pixel area. The first light emitting element emits light of a first color and has a first luminous efficiency-injection current density function. The second light emitting element emits light of a second color and has a second luminous efficiency-injection current density function, intersected with the first luminous efficiency-injection current density function to define a critical transform current density. The light of the first color and the light of the second color have a same color system.

Display device and method for controlling the same

A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has at least one sidewall and includes a light emitting layer, a first semiconductor layer, and a second semiconductor layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first electrode is electrically connected to the first semiconductor layer of the semiconductor structure. The first semiconductor layer is disposed between the light emitting layer and the first electrode. The second electrode is electrically connected to the second semiconductor layer of the semiconductor structure. The second semiconductor layer is disposed between the light emitting layer and the second electrode. The extending electrode is disposed on the sidewall of the semiconductor structure and is electrically connected to the second electrode.

Growing community of inventors

Hsin-Chu, Taiwan

Chin-Yuan Ho