Microjet Technology Company, Ltd.

Chin-Yi Chou

Tse-Chi Mou

Ying-Lun Chang

Cheng-Hung Yu

Arnold Chang-Mou Yang

Jing-Yuan Ho

Fu-San Lin

Ta-Wei Hsueh

Yi-Jing Leu

Hung-Chun Tsai

Li-Hsing Peng

Kou-Yow Tseng

Yee-Shyi Chang

Shiang-Ching Cheng

Shiang Ching Cheng

A method of manufacturing a printhead for raising its product acceptance rate and improving its quality is provided. The method of manufacturing printheads includes steps of providing a base layer, forming a pattern layer on the base layer by a semi-conductor manufacturing process, forming a dry film of a channel barrier layer having an ink channel, a flow channel and plural ink cavities on the pattern layer; and adhering a nozzle plate on the dry film of the channel barrier layer by thermal compression. The pattern layer further includes a flow pattern and a base pattern surround a central location reserved for the ink channel, wherein the base pattern comprises at least a heating layer and a passivation layer, and the flow pattern is made of the same material and at the same height as the base pattern.

Method of manufacturing printhead

A structure of a printhead for raising its product acceptance rate and improving its quality is provided. The structure of a printhead includes a base layer, a pattern layer disposed on the base layer, a channel barrier layer having a dry film, an ink channel, a flow channel and plural ink cavities on the pattern layer, and a nozzle plate adhered to the dry film of the channel barrier layer by thermal compression. The pattern layer further includes a flow pattern and a base pattern surrounding a central location for forming thereabove the ink channel.

Structure of printhead

An ink-jet cartridge adapted to be used for a thermal ink-jet printer is disclosed. The ink-jet cartridge includes a housing for storing the ink in an interior thereof, a printhead having a plurality of orifices thereon for allowing the ink to be Jetted therethrough when the thermal ink-jet printer is printing, and a pressure-adjusting device disposed in the housing for regulating a back pressure of the interior of the housing, wherein the pressure-adjusting device includes a first opening fixed on an upper portion of the housing and exposed to an ambient atmosphere, and a second opening disposed at a bottom of the interior of the housing and having at least one regulating hole thereon. Each regulating hole has a cross-sectional area being smaller than that of the first opening for maintaining the back pressure when the ink-jet cartridge is inverted.

Ink-jet cartridge

A pressure adjustment device in an ink cartridge employs an elastic air bag in communication with the atmosphere through a ventilation hole in a connection body which is installed in a top wall of the cartridge housing. Response to pressure changes is increased by a spring connected between a bottom end of the air bag and a bottom wall of the cartridge housing which applies a pulling force to the bottom end of the air bag.

Ink-jet cartridge with pressure adjustment device

A manufacturing process and a structure for an ink jet printhead with high quality, yield rate, and performance are provided. The process includes steps of: a) providing a substrate, b) forming a dielectric layer over the substrate, c) forming a resistor over the dielectric layer, d) forming a conducting layer over a portion of the resistor, e) forming a passivation over a portion of the conducting layer and another portion of the resistor not covered by the conducting layer, f) forming a hole over the passivation for storing an ink, and g) forming a nozzle over the hole for ejecting therethrough the ink.

Manufacturing process and structure of ink jet printhead

A method for creating via holes in a chip or a plurality of chips of a wafer is disclosed. The method is performed by using a pre-patterned transparent mask on the back of the chip or chips, and bombarding the chip(s) through the positioning holes on the transparent mask that correspond to the pre-formed pattern, with accelerated particles. According to this method, via holes can be created from the back of the chip(s) without interfering with the existing IC structure of the chip(s). The present method is highly efficient because a number of via holes can be formed simultaneously by using a large pre-pattered mask to cover the entire wafer. In addition, the present method is cost-effective because no precision apparatus is required.

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Hsin-Chu, Taiwan

Chin-Yi Chou