Wintek Corporation

United Win (china) Technology Ltd

Chin-Wen Lo

Ming-Chuan Lin

Yu-Jen Tsai

Zhi-Ting Ye

Bo Yu

Shih-Cheng Wang

Chang-Wei Yu

Yu-Liang Chow

Chia-Ta Chang

Hsueh-Chih Wu

Yueh-Fang Wang

Ju-Fen Yang

Tso-Wei Liao

Wen-Hsiao Huang

Chia-Ning Kao

Chih-Hsien Lien

Wei-Wen Hsueh

Hsuan Wang

Light emitting diode tube

A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.

Golden finger for flexible printed circuitboard

A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a position corresponding to the intersection with the at least one circuit pattern; wherein the depth of the at least one groove is no larger than the thickness of the corresponding circuit pattern for preventing the circuit pattern from being cut off by the groove. By configuring the aforesaid bendable area in the FPC, stress generated by the bending of the FPC is restricted inside the bendable area effectively so that accurate control of the bending angle for bending FPC can be realized.

Bendable area design for flexible printed circuitboard

The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.

Flexible printed circuit board and liquid crystal display with the flexible printed circuit board

A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.

Pin layout of a golden finger for flexible printed circuitboard

A liquid crystal module has a liquid crystal panel and a flexible printed circuit board. The liquid crystal panel has a substrate and an indium tin oxide (ITO) film on the substrate. A flexible printed circuit board has an insulating layer on which a lower conductive layer, a second protective layer, an upper conductive layer and a first protective layer are stacked in sequence. The lower conductive layer is electrically connected to predetermined portions of the lower conductive layer and has a conductive portion, which is unshielded by the insulating layer. The flexible printed circuit board is bonded to the liquid crystal panel with the insulting layer stacked on the indium tin oxide film and the pins of the indium tin oxide film electrically connected to the conductive portion of the lower conductive layer.

Liquid crystal module

Growing community of inventors

Taichung, Taiwan

Chin-Wen Lo