Mediatek Corporation

E Ink Holdings Inc.

Chin-Wei Lin

Ted-Hong Shinn

Po-Hsin Lin

Chi-Liang Wu

Yun-San Huang

Chia-Yu Yang

Yu-Lin Yang

Chia-Chun Sun

Chih-Min Lin

A dynamic voltage stress (DVS) condition optimization includes selecting a testing block from a plurality of blocks in a die of a wafer, acquiring a plurality of testing block measurement temperatures of the testing block when the testing block is processed by a DVS testing flow, acquiring a correlation table of the plurality of testing block measurement temperatures and a plurality of DVS block predict temperatures of the testing block, configuring a tip burnt block temperature according to the testing block measurement temperatures, determining a DVS block target temperature selected from the DVS block predict temperatures according to the correlation table and the tip burnt block temperature, and generating a DVS block voltage for applying to the testing block in the die of the wafer according to the DVS block target temperature.

Dynamic voltage stress condition optimization method and dynamic voltage stress condition optimization system capable of performing block-based dynamic voltage stress wafer testing process

A driving substrate is disclosed. The driving substrate includes a first substrate. The first substrate has a display zone and a border zone surrounding the display zone. The border zone includes at least one active area and at least one non-active area. The active area includes a first conductive layer disposed on the first substrate. The non-active area connects the active area to form the border zone. A display using the driving substrate is also disclosed.

Driving substrate and display using the same

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Hsinchu, Taiwan

Chin-Wei Lin