Freescale Semiconductor,inc.

Nxp Usa, Inc.

Chin Teck Siong

Wai Yew Lo

Teck Beng Lau

Lan Chu Tan

Boon Yew Low

Chee Seng Foong

Chu-Chung Lee

Tu-Anh N Tran

Poh Leng Eu

Ly Hoon Khoo

Zi Song Poh

Yin Kheng Au

Meijiang Song

Jia Lin Yap

Vanessa Wyn Jean Tan

John G Arthur

Matthew J Zapico

A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.

Semiconductor device with bond wire reinforcement structure

A substrate having a die attach area for receiving a semiconductor die includes a recessed area for receiving die attach adhesive. The recessed area prevents die attach adhesive from bleeding into the surrounding area and onto substrate connection sites, where it could compromise a wire bond formed on such a connection site. The recessed area has a zig-zag pattern, which allows for sufficient amounts of adhesive to be used to securely attach the die to the substrate, yet does not enlarge the recessed area such that the package size may be adversely affected.

Substrate with reservoir for die attach adhesive

A method for assembling a thin, flexible integrated circuit (IC) device includes using an etched contoured lead frame having raised features. A die is attached to the lead frame to form a sub-assembly that is then selectively coated with a low-modulus gel. The sub-assembly is covered with a temporary mask for sputter deposition of a metallic seed layer for interconnects between the die and the raised features. The mask is removed and more robust metal interconnects are grown over the seed paths using electroplating. The sub-assembly top is then coated with another gel layer. The bottom of the sub-assembly and of the contoured lead frame is removed, which transforms the raised features into leads. The newly exposed bottom of the sub-assembly is covered with a third layer of gel to complete assembly of the packaged device.

Flexible packaged integrated circuit

An integrated circuit copper wire bond connection is provided having a copper ball () bonded directly to an aluminum bond pad () formed on a low-k dielectric layer () to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location () under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.

Copper ball bond interface structure and formation

A method of attaching a bond wire to first and second electrical contact pads includes holding the bond wire in a capillary, wherein a first end of the bond wire extends out of an opening in the capillary, attaching the first end of the bond wire to the first electrical contact pad using a ball bonding technique, moving a second end of the bond wire toward the second electrical contact pad after the attachment of the first end of the bond wire, performing an electric flame off on the second end of the bond wire without forming a free air ball, and attaching the second end of the bond wire to the second electrical contact pad after the EFO on the second end of the bond wire.

Insulated wire bonding with EFO before second bond

A self-powered circuit package includes a substrate and an integrated circuit (IC). The IC is mounted on a surface of the substrate. An electrical interconnector electrically couples the IC to the substrate. A solar cell is provided having opposing first and second main surfaces. A portion of the first main surface of the solar cell is configured to receive light from an external source. The solar cell converts energy of the received light into electrical power. The solar cell is disposed above the IC and electrically connected to the IC by way of the substrate to supply the generated power to the IC. A clear mold compound encapsulates a surface of the substrate, the IC, the electrical interconnector, and the solar cell.

Solar powered IC chip

A self-powered integrated circuit (IC) device includes a lead frame and a solar cell having first and second main surfaces. The solar cell is mounted on a surface of the lead frame. An IC chip is also provided. A first electrical interconnector electrically couples the IC chip to the lead frame and a second electrical interconnector electrically couples the solar cell to the IC chip. A portion of the first main surface of the solar cell is configured to receive light from an external source. The solar cell converts energy of the received light into electrical power that is supplied to the IC chip. A mold compound encapsulates the IC chip, the first and second electrical interconnectors, and at least a portion of the solar cell.

Growing community of inventors

Shah Alam, Malaysia

Chin Teck Siong