Hon Hai Precision Industry Co., Ltd.

Chin-Shen Wu

Kuo-Cheng Wang

Charles Chou

An I/O card device includes a metallic, rectangular upper cover having two longitudinal sides each having an L-shaped cross-section with a bottom wall facing each other and defining a number of holes, an upper insulative frame injection molded to the upper cover to fixedly connect therewith in which the upper frame fills the holes of the longitudinal sides, a lower metallic cover having a structure similar to the upper cover, a lower insulative frame having a structure similar to the upper frame and insert molded to the lower cover to fill the holes thereof. The upper frame and lower frame are connected together by ultrasonic soldering. A front connector is fixed to a front end of the device by engaging two lateral mounting ears of the front connector to front ends of the upper and lower frames. A rear connector is fixed to a rear end of the device by engaging two lateral mounting ears of the rear connector to rear ends of the upper and lower frames. A printed circuit board is fixedly received in the device and electrically connected to the front and rear connectors.

Growing community of inventors

Yung-Ho, Taiwan

Chin-Shen Wu