Taiwan Semiconductor Manufacturing Comp. Ltd.

Chin-Shen Hsieh

Ming-Sze Chen

Cheng-Yi Huang

Chun-Ta Chen

Kai-Wen Wu

Chung-Hsien Liao

In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Heater lift assembly spring damper

Converter and conversion method for converting a click position of a flat panel display into a light pen simulated signal for a semiconductor manufacturing machine are provided. A converter includes a first connector, a second connector, and a controller coupled between the first connector and the second connector. The first connector is configured to obtain the click position from the flat panel display. The second connector is configured to provide the light pen simulated signal to the semiconductor manufacturing machine according to a synchronization signal from the semiconductor manufacturing machine. The controller is configured to generate the light pen simulated signal according to the click position and a mapping table of a first display resolution of the flat panel display and a second display resolution of the semiconductor manufacturing machine. The first display resolution is higher than the second display resolution.

Converter and conversion method for converting click position of display into light pen simulated signal for semiconductor manufacturing machine

Disclosed is a substrate displacing assembly so as to improve its durability during a semiconductor processing. In one embodiment, a semiconductor manufacturing system, includes, a substrate holder, wherein the substrate holder is configured with a plurality of pins; and a substrate displacing assembly for displacing a substrate on the substrate holder in a first direction perpendicular to the top surface of the substrate holder through the plurality of pins, wherein the substrate displacing assembly comprises a pair of load forks, a coupler and a driving shaft, wherein the pair of load forks comprises a fork region and a base region, wherein the coupler is mechanically coupled to the base region through at least one first joining screw extending in the first direction, wherein the coupler is further mechanically coupled to the driving shaft through a second joining screw extending in the first direction.

Vacuum wafer chuck for manufacturing semiconductor devices

Converter and conversion method for converting a click position of a flat panel display into a light pen simulated signal for a semiconductor manufacturing machine are provided. A first interface circuit is configured to communicate with the flat panel display to obtain the click position. A second interface circuit is configured to communicate with the semiconductor manufacturing machine to obtain horizontal and vertical synchronization signals. A memory is configured to store a first display resolution of the flat panel display and a second display resolution of the semiconductor manufacturing machine. A processor is configured to obtain the light pen simulated signal according to a light pen position corresponding to the click position and the first and second display resolutions and to control the second interface circuit to provide the light pen simulated signal to the semiconductor manufacturing machine according to the horizontal and vertical synchronization signals.

Converter and conversion method for converting a click position of a flat panel display into a light pen simulated signal for a semiconductor manufacturing machine are provided. The converter includes a first connector, a second connector, and a controller. The first connector is configured to receive a first display resolution and the click position from the flat panel display. The second connector is configured to receive a synchronization signal and a second display resolution from the semiconductor manufacturing machine. The controller is configured to obtain the light pen simulated signal according to a light pen position corresponding to the click position, and to control the second connector to provide the light pen simulated signal to the semiconductor manufacturing machine according to the synchronization signal.

Converter and conversion method for converting a click position of a flat panel display into a light pen simulated signal for a semiconductor manufacturing machine are provided. A converter includes a first connector, a second connector, and a controller. The first connector is configured to relay the click position of the flat panel display with a first display resolution. The second connector is configured to relay a horizontal synchronization signal and a vertical synchronization signal from the semiconductor manufacturing machine and a second display resolution. The controller converts the click position into a light pen position according to the first and second display resolutions, and provides the light pen simulated signal to the semiconductor manufacturing machine through the second connector according to the light pen position, the horizontal synchronization signal and the vertical synchronization signal.

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Hsinchu, Taiwan

Chin-Shen Hsieh