Sony Emcs (Malaysia) Sdn. Bhd.

Chin Ngiap Heng

An earphone has a casing that consists of a base housing () and a rear housing (). The base housing and the rear housing enclose the speaker of the earphone and the base housing has an orifice () in it so that a wire carrying an audio signal could be provided to the speaker. The base housing is attached to the rear housing using a catch locking mechanism (). The earphone further includes a ring which fits on the position where the catch lock engages and provides added strength to catch locking mechanism. The earphone is able to withstand a drop from a height of up to 1.8 m with the ring locking mechanism in engaged position on the earphone casing. Furthermore the ring could be easily removed when the earphone requires servicing or repair and reattached for reuse without causing damage to the earphone casing.

Growing community of inventors

Penang Island, Malaysia

Chin Ngiap Heng