Taiwan Semiconductor Manufacturing Comp. Ltd.

Chin-Nan Chang

Chi-Feng Huang

Victor Chiang Liang

Chia-Chung Chen

Fu-Huan Tsai

Chun-Pei Wu

Chung-Hao Chu

Ching-Yu Yang

Ankush Chaudhary

Chih-Ming Lee

Chi-Yen Lin

Cheng-Yeh Huang

Gulbagh Singh

A method for forming a semiconductor device structure is provided. The method includes forming a semiconductor strip structure over a semiconductor substrate. The semiconductor strip structure has a first doped region and a spacing region connected to the first doped region, and the spacing region is an undoped region. The method includes performing an implantation process over the first doped region and the spacing region to convert a first upper portion of the first doped region and a second upper portion of the spacing region into a continuous disorder region. The method includes forming a metal-semiconductor compound layer over the semiconductor strip structure to continuously cover the first doped region and the spacing region after the implantation process.

Method for forming semiconductor device structure with metal-semiconductor compound layer

A method for forming a semiconductor device structure is provided. The method includes providing a semiconductor substrate. The method includes forming an isolation structure in the semiconductor substrate. The isolation structure surrounds a first active region of the semiconductor substrate. The method includes forming a semiconductor strip structure over the semiconductor substrate. The semiconductor strip structure extends across the first active region and extends over the isolation structure, the semiconductor strip structure has a first doped region and a spacing region connected to the first doped region, the first doped region extends across the first active region, the spacing region is over the isolation structure, and the spacing region is an undoped region. The method includes performing an implantation process over the spacing region. The method includes forming a metal silicide layer over the semiconductor strip structure to continuously cover the first doped region and the spacing region.

Method for forming semiconductor device structure with metal silicide layer

A semiconductor device and method of forming the same are provided. The semiconductor device includes a substrate, a growth promoting region, a first gate stack, and a second gate stack. The substrate includes a first region and a second region. The growth promoting region is located in a surface of the substrate in the first region. The growth promoting region includes a first implantation species, and a surface of the substrate in the second region is free of the first implantation species. The first gate stack includes a first gate dielectric layer on the substrate in the first region. The second gate stack includes a second gate dielectric layer on the substrate in the second region.

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a gate stack, a first doped region, a second doped region, and a buried doped region. The first doped region has a first conductivity type and is located in the substrate at a first side of the gate stack. The second doped region has the first conductivity type and is located in the substrate at a second side of the gate stack. The buried doped region has the first conductivity type and is buried in the substrate, extended from the first doped region to the second doped region, and separated from the gate stack by a distance.

A method for forming a semiconductor device structure is provided. The method includes providing a semiconductor substrate. The method includes forming an isolation structure in the semiconductor substrate. The isolation structure surrounds a first active region and a second active region of the semiconductor substrate. The method includes forming a semiconductor strip structure over the semiconductor substrate. The semiconductor strip structure extends across the first active region, the second active region, and the isolation structure between the first active region and the second active region, the semiconductor strip structure has a P-type doped region, an N-type doped region, and a spacing region. The method includes performing an implantation process over the spacing region. The method includes forming a metal silicide layer over the semiconductor strip structure to cover the P-type doped region, the N-type doped region, and the spacing region.

Provided is a semiconductor device includes a gate stack, a first doped region, a second doped region, a first lightly doped region and a second lightly doped region. The gate stack is disposed on a substrate. The first doped region is located in the substrate at a first side of the gate stack. The second doped region is located in the substrate at a second side of the gate stack. The first lightly doped region is located in the substrate between the gate stack and the first doped region. The second lightly doped region is located in the substrate between the gate stack and the second doped region. A property of the first lightly doped region is different from a property of the second lightly doped region.

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Tainan, Taiwan

Chin-Nan Chang